Abstract: A display apparatus includes a plurality of inorganic light emitting diodes (LEDs) configured to form a single pixel, a plurality of signal electrodes configured to supply a data signal to the plurality of inorganic LEDs, and a common electrode configured to provide a ground to the plurality of inorganic LEDs.

Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.

Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.

Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.

Abstract: A display apparatus includes a plurality of inorganic light emitting diodes (LEDs) configured to form a single pixel, a plurality of signal electrodes configured to supply a data signal to the plurality of inorganic LEDs, and a common electrode configured to provide a ground to the plurality of inorganic LEDs.

Abstract: A fingerprint recognition device includes: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper portion of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at under the integrated circuit; a molding layer provided under the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.

Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.

Abstract: Disclosed are fingerprint recognition device having an improved structure to enable a driving device of an integrated circuit to have durability, a manufacturing method therefor, and an electronic device. The fingerprint recognition device comprise: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper portion of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at under the integrated circuit; a molding layer provided under the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.

Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.

Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Abstract: Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights.

Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.

Abstract: A method of manufacturing a wafer-level flip chip package is capable of being used to produce a flip chip package by directly coating a flip chip package using anisotropic conductive adhesives (ACA) and non conductive adhesives (NCA) in a solution state as a double layer on a wafer. The method can be used to manufacture a non-conductive mixed solution and a conductive mixed solution and directly coat them on a substrate, such that it is possible to: increase productivity; simplify a manufacturing process; suppress a shadow effect; easily perform thickness control that is difficult with the anisotropic conductive adhesive paste or the non-conductive adhesive paste; and obtain the non-conductive layer and the anisotropic conductive layer in an initial state of a B-stage with a level not losing latent of hardening through a simple drying process to volatilize an organic solvent.

Abstract: A polymer/ceramic composite paste for an embedded capacitor includes an organic solvent, a ceramic powder having a particle diameter of not more than 20 ?m dispersed in the organic solvent, a polymer and a hardener. The use of the polymer/ceramic composite paste enables the formation of a dielectric layer having a high dielectric constant. The polymer/ceramic composite paste can be applied by a screen printing technique and is planarized to locally form a polymer/ceramic composite dielectric layer having a thickness of, e.g., up to 20 ?m on a desired region. Accordingly, electrical parasitics resulting from the formation of a capacitor on unwanted regions can be reduced, and the capacitance error can be reduced.