Patents by Inventor Kyuong-Hwan LIM

Kyuong-Hwan LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and manufacturing method for the same
    Patent number: 11166365
    Abstract: A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: November 2, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: A-ran Lee, Kee-Ju Um, Ju-Ho Kim, Myeong-Hui Jung, Kyuong-Hwan Lim, Jin-Won Lee, Seung-On Kang, Jong-Guk Kim
  • PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
    Publication number: 20200170102
    Abstract: A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.
    Type: Application
    Filed: October 25, 2019
    Publication date: May 28, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: A-ran LEE, Kee-Ju UM, Ju-Ho KIM, Myeong-Hui JUNG, Kyuong-Hwan LIM, Jin-Won LEE, Seung-On KANG, Jong-Guk KIM