Patents by Inventor Kyutaro Hayashi
Kyutaro Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7641388Abstract: A temperature sensor includes a temperature sensor element, a housing and a supporting member. The temperature sensor element detects a temperature of media. The housing accommodates a terminal electrically connected to an outside circuit. The terminal is connected to the temperature sensor element through a lead having a strength insufficient for supporting the temperature sensor element. The supporting member accommodates the lead. The supporting member is made of a hot-melt adhesive, and connected to a part of the housing.Type: GrantFiled: April 3, 2007Date of Patent: January 5, 2010Assignee: DENSO CORPORATIONInventor: Kyutaro Hayashi
-
Publication number: 20070237205Abstract: A temperature sensor includes a temperature sensor element, a housing and a supporting member. The temperature sensor element detects a temperature of media. The housing accommodates a terminal electrically connected to an outside circuit. The terminal is connected to the temperature sensor element through a lead having a strength insufficient for supporting the temperature sensor element. The supporting member accommodates the lead. The supporting member is made of a hot-melt adhesive, and connected to a part of the housing.Type: ApplicationFiled: April 3, 2007Publication date: October 11, 2007Applicant: DENSO CORPORATIONInventor: Kyutaro Hayashi
-
Patent number: 7216546Abstract: A pressure sensor includes a case, terminals, a pressure sensing element, a port, and a temperature sensing element. The terminals are assembled to the case by insert molding and connectable to an external device. The pressure sensing element is electrically connected with the terminals and housed in the case. The port having a pressure receiving hole through which a pressure transmitting medium is led to the pressure sensing element is connected with the case. The temperature sensing element is electrically connected with the terminals and arranged in the pressure receiving hole. A part of each terminal is passed through the pressure receiving hole and extended to the temperature sensing element. The extended part is electrically connected to the temperature sensing element. The extending portion is formed as an insert molding portion of the case and held with a material forming the case.Type: GrantFiled: March 24, 2005Date of Patent: May 15, 2007Assignee: Denso CorporationInventors: Kyutaro Hayashi, Keiji Horiba
-
Patent number: 7043993Abstract: A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor and an outside circuit, and a port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor is disposed in the pressure introduction port, and electrically connects to the connector pin through a lead wire. The lead wire with the temperature sensor is supported by a connection portion disposed between the connector pin and the lead wire. The lead wire has a buffer disposed between the lead wire and a part of the pressure introduction port for reducing a vibration of both the temperature sensor and the lead wire.Type: GrantFiled: October 23, 2003Date of Patent: May 16, 2006Assignee: Denso CorporationInventors: Kyutaro Hayashi, Takashige Saitou, Yukihiro Kato
-
Publication number: 20050210990Abstract: A pressure sensor includes a case, terminals, a pressure sensing element, a port, and a temperature sensing element. The terminals are assembled to the case by insert molding and connectable to an external device. The pressure sensing element is electrically connected with the terminals and housed in the case. The port having a pressure receiving hole through which a pressure transmitting medium is led to the pressure sensing element is connected with the case. The temperature sensing element is electrically connected with the terminals and arranged in the pressure receiving hole. A part of each terminal is passed through the pressure receiving hole and extended to the temperature sensing element. The extended part is electrically connected to the temperature sensing element. The extending portion is formed as an insert molding portion of the case and held with a material forming the case.Type: ApplicationFiled: March 24, 2005Publication date: September 29, 2005Inventors: Kyutaro Hayashi, Keiji Horiba
-
Patent number: 6813952Abstract: A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor to an outside circuit, and an inlet port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor comprises a temperature sensing element and a pair of lead wires and is disposed in the pressure introduction port. The lead wires of the temperature sensor are welded to and supported by the connector pin. One of the lead wires is formed as a U-shape and inserted into the pressure introduction port while the U-shaped lead wire is inwardly depressed, so that a reaction force is generated at the lead wire, which outwardly urges the lead wire and the temperature sensing element to an inner wall of the pressure introduction port.Type: GrantFiled: March 4, 2004Date of Patent: November 9, 2004Assignee: Denso CorporationInventors: Yasuhiro Yamashita, Kyutaro Hayashi, Yukihiro Kato
-
Publication number: 20040182163Abstract: A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor to an outside circuit, and an inlet port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor comprises a temperature sensing element and a pair of lead wires and is disposed in the pressure introduction port. The lead wires of the temperature sensor are welded to and supported by the connector pin. One of the lead wires is formed as a U-shape and inserted into the pressure introduction port while the U-shaped lead wire is inwardly depressed, so that a reaction force is generated at the lead wire, which outwardly urges the lead wire and the temperature sensing element to an inner wall of the pressure introduction port.Type: ApplicationFiled: March 4, 2004Publication date: September 23, 2004Applicant: DENSO CORPORATIONInventors: Yasuhiro Yamashita, Kyutaro Hayashi, Yukihiro Kato
-
Publication number: 20040134282Abstract: A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor and an outside circuit, and a port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor is disposed in the pressure introduction port, and electrically connects to the connector pin through a lead wire. The lead wire with the temperature sensor is supported by a connection portion disposed between the connector pin and the lead wire. The lead wire has a buffer disposed between the lead wire and a part of the pressure introduction port for reducing a vibration of both the temperature sensor and the lead wire.Type: ApplicationFiled: October 23, 2003Publication date: July 15, 2004Inventors: Kyutaro Hayashi, Takashige Saitou, Yukihiro Kato