Patents by Inventor L. H. Lee

L. H. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rapid thermal annealing process
    Patent number: 7026171
    Abstract: A rapid thermal annealing (“RTA”) process providing for an RTA equipment is disclosed. The RTA equipment has a pyrometer providing for measuring an operation parameter, e.g., a temperature of the RTA process. The RTA process comprises steps of proceeding a first RTA step to a wafer in the RTA equipment, then comparing a measured value of the operation parameter with a reference range of value of the operation parameter, thereafter proceeding a second RTA step to the wafer in the RTA equipment when the measured value of the operation parameter is in between the reference range of value of the operation parameter. When the measured value of the operation parameter is out of the reference range of value of the operation parameter, the RTA equipment is turned off, and the wafer is unloaded from the RTA equipment and loaded into another RTA equipment to complete the RTA process.
    Type: Grant
    Filed: July 4, 2003
    Date of Patent: April 11, 2006
    Assignee: Macronix International Co., Ltd.
    Inventors: Y. Y. Chang, Shih-Liang Chou, L. H. Lee, Tsung-De Lin, Kou-Yow Tseng, Wen-Cheng Lien
  • [RAPID THERMAL ANNEALING PROCESS]
    Publication number: 20040224538
    Abstract: A rapid thermal annealing (“RTA”) process providing for an RTA equipment is disclosed. The RTA equipment has a pyrometer providing for measuring an operation parameter, e.g., a temperature of the RTA process. The RTA process comprises steps of proceeding a first RTA step to a wafer in the RTA equipment, then comparing a measured value of the operation parameter with a reference range of value of the operation parameter, thereafter proceeding a second RTA step to the wafer in the RTA equipment when the measured value of the operation parameter is in between the reference range of value of the operation parameter. When the measured value of the operation parameter is out of the reference range of value of the operation parameter, the RTA equipment is turned off, and the wafer is unloaded from the RTA equipment and loaded into another RTA equipment to complete the RTA process.
    Type: Application
    Filed: July 4, 2003
    Publication date: November 11, 2004
    Inventors: Y. Y. Chang, Shih-Liang Chou, L. H. Lee, Tsung-De Lin, Kou-Yow Tseng, Wen-Cheng Lien