Patents by Inventor L. H. Lin

L. H. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060011329
    Abstract: A heat pipe heat sink with a holeless fin module is disclosed in the present invention. Because of the holeless arrangement the heat pipe heat sink is much more convenient for manufacturing. The heat generated by an electrical component can quickly be transferred into the heat pipe and uniformly distributed to each of the heat dissipating fins. The heat pipe heat sink includes a heat dissipating fin module, a heat conducting member, one or more heat pipes installed on the heat conducting member, and a heat conducting plate which is thermally connected to the heat conducting member and the electrical component. The end surface of the heat conducting member with the heat pipe installed thereon is convenient for application of an adhesive because the end surface and the pipe wall of the heat pipe are exposed outside of the heat dissipating fin module before any combination takes place.
    Type: Application
    Filed: July 16, 2004
    Publication date: January 19, 2006
    Inventors: Jack Wang, Michael Lin, Charles Ma, L.H. Lin
  • Patent number: 6212324
    Abstract: A holder for single head fiber optic connectors comprises a body and a pair of arms. The body has a guarding portion. The arms extend from the body so as to form a pair of receiving spaces between the body and the arms. The single head fiber optic connectors are held in the receiving spaces by the arms and the guarding portion.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: April 3, 2001
    Assignee: UCONN Technology Inc.
    Inventors: Samuel I-En Lin, L. H. Lin