Patents by Inventor L. James Lee

L. James Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for modeling plastic molding and molding parts incorporating the same
    Patent number: 5581468
    Abstract: A system and method for simulating LCM mold filling utilizes at least one processor, suitable RAM and storage memory, input means, display means, and logic for simulating the injection of resin into a mold cavity containing a preform based upon mold cavity design parameters, mold filling processing parameters, physical property parameters, and system processing parameters, and identifying the current state of selected mold filling conditions at selected points in time during the simulated mold filling process. The system includes logic for identifying incipient dry spots, and also preferably includes means for interrupting the operation of the program at selected points to vary selected parameters to eliminate incipient dry spots and otherwise maximize the mold filling process.
    Type: Grant
    Filed: January 11, 1995
    Date of Patent: December 3, 1996
    Assignee: The Dow Chemical Co.
    Inventors: Warren D. White, Muhammad A. Shafi, L. James Lee, Kerang Han
  • Modification of unsaturated polyester resins for viscosity control
    Patent number: 5561192
    Abstract: An unsaturated polyester resin and low profile additive containing diketo groups.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: October 1, 1996
    Assignee: The Ohio State University
    Inventors: L. James Lee, Reiko Saito, Debbie Yuen-Yuen Chiu