Patents by Inventor L. Jan Bissey

L. Jan Bissey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink for chip stacking applications
    Patent number: 6707673
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: March 16, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Heat sink for chip stacking applications
    Publication number: 20020186539
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Application
    Filed: July 29, 2002
    Publication date: December 12, 2002
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Heat sink for chip stacking applications
    Patent number: 6449161
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: September 10, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Heat sink for chip stacking applications
    Patent number: 6319756
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: November 20, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Heat sink for chip stacking applications
    Publication number: 20010005311
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Application
    Filed: December 22, 2000
    Publication date: June 28, 2001
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Heat sink for chip stacking applications
    Publication number: 20010000684
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Application
    Filed: December 22, 2000
    Publication date: May 3, 2001
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Heat sink for chip stacking applications
    Patent number: 6201695
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: March 13, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Printed circuit board with integrated heat sink
    Patent number: 6031727
    Abstract: According to the present invention, functional heat conducting planar layers within a printed circuit board (PCB) are corrugated to allow for enhanced heat dissipation. According to a preferred embodiment, at least one of the power and ground planes is at least partially corrugated to extract heat from the PCB. By corrugating heat conducting structures within the PCB, additional heat dissipating surface area is provided for the PCB without the need to provide any additional heat dissipating structure.
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: February 29, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Kevin G. Duesman, L. Jan Bissey