Patents by Inventor L. Todd Biggs

L. Todd Biggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
    Patent number: 7053491
    Abstract: Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: May 30, 2006
    Assignee: Intel Corporation
    Inventors: Edward L. Martin, L. Todd Biggs
  • Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
    Publication number: 20030146505
    Abstract: Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.
    Type: Application
    Filed: February 4, 2002
    Publication date: August 7, 2003
    Inventors: Edward L. Martin, L. Todd Biggs