Abstract: A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contacts are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between a surface of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. At least two leads of the DIP package are inserted into the pair of insertable contacts in the auxliary isulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board. In one embodiment, other DIP leads pass through clearance holes in a second pair of integral tabs.

Abstract: A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contacts are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between the top of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. Two leads of the DIP package are inserted into the pair of insertable contacts in the auxiliary insulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board.