Patents by Inventor Lada Schovanec

Lada Schovanec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single inline packaged solid state relay with high current density capability
    Patent number: 5220197
    Abstract: An AC solid state relay in a single inline package (SIP) comprised of dual silicon controlled rectifiers (SCRs) with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy. And a DC solid state relay in a single inline package (SIP) comprised of an NPN power transistor with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy.
    Type: Grant
    Filed: March 24, 1992
    Date of Patent: June 15, 1993
    Assignee: Silicon Power Corporation
    Inventor: Lada Schovanec
  • Single inline packaged solid state relay with high current density capability
    Patent number: 5134094
    Abstract: An AC solid state relay in a single inline package (SIP) comprised of dual silicon controlled rectifiers (SCRs) with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy. And a DC solid state relay in a single inline package (SIP) comprised of an NPN power transistor with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy.
    Type: Grant
    Filed: July 22, 1991
    Date of Patent: July 28, 1992
    Assignee: Silicon Power Corporation
    Inventor: Lada Schovanec