Abstract: A medical instrument includes cable pairs respectively wound around input spindles and connected to actuate degrees of freedom of an instrument shaft structure. The cables may connect so that rotating the input spindles actuates corresponding degrees of freedom. First pulleys in the instrument may receive first cables from the input spindles and redirect the first cables toward the instrument shaft, and second pulleys may receive second cables from the input spindles and redirect the second cables toward the instrument shaft. In one configuration, the first and second pulleys are respectively mounted at first and second levels, and the second pulleys redirect the second cables through the first level. Additionally or alternatively, one level of cables may cross while the other level of cables does not.

Abstract: A medical instrument includes cable pairs respectively wound around input spindles and connected to actuate degrees of freedom of an instrument shaft structure. The cables may connect so that rotating the input spindles actuates corresponding degrees of freedom. First pulleys in the instrument may receive first cables from the input spindles and redirect the first cables toward the instrument shaft, and second pulleys may receive second cables from the input spindles and redirect the second cables toward the instrument shaft. In one configuration, the first and second pulleys are respectively mounted at first and second levels, and the second pulleys redirect the second cables through the first level. Additionally or alternatively, one level of cables may cross while the other level of cables does not.

Abstract: A medical instrument includes cable pairs respectively wound around input spindles and connected to actuate degrees of freedom of an instrument shaft structure. The cables may connect so that rotating the input spindles actuates corresponding degrees of freedom. First pulleys in the instrument may receive first cables from the input spindles and redirect the first cables toward the instrument shaft, and second pulleys may receive second cables from the input spindles and redirect the second cables toward the instrument shaft. In one configuration, the first and second pulleys are respectively mounted at first and second levels, and the second pulleys redirect the second cables through the first level. Additionally or alternatively, one level of cables may cross while the other level of cables does not.

Abstract: A medical instrument includes cable pairs respectively wound around input spindles and connected to actuate degrees of freedom of an instrument shaft structure. The cables may connect so that rotating the input spindles actuates corresponding degrees of freedom. First pulleys in the instrument may receive first cables from the input spindles and redirect the first cables toward the instrument shaft, and second pulleys may receive second cables from the input spindles and redirect the second cables toward the instrument shaft. In one configuration, the first and second pulleys are respectively mounted at first and second levels, and the second pulleys redirect the second cables through the first level. Additionally or alternatively, one level of cables may cross while the other level of cables does not.

Abstract: A medical instrument includes cable pairs respectively wound around input spindles and connected to actuate degrees of freedom of an instrument shaft structure. The cables may connect so that rotating the input spindles actuates corresponding degrees of freedom. First pulleys in the instrument may receive first cables from the input spindles and redirect the first cables toward the instrument shaft, and second pulleys may receive second cables from the input spindles and redirect the second cables toward the instrument shaft. In one configuration, the first and second pulleys are respectively mounted at first and second levels, and the second pulleys redirect the second cables through the first level. Additionally or alternatively, one level of cables may cross while the other level of cables does not.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contracts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.