Abstract: Fiber optic cable systems and methods incorporating a luminescent compound-containing layer to identify cracks. Exemplary embodiments include a fiber optic cable apparatus including a core for receiving laser light emitted from a VCSEL for the detection of faults in the fiber optic cable, a cladding disposed around the core, the cladding having an index of retraction differential with the core thereby allowing containment of light within the core by total internal reflection within the core, a buffer disposed around the cladding, the buffer capable of receiving LED emitted light for the detection of faults in the fiber optic cable, a braiding layer disposed around the buffer and configured to allow LED light to transmit from the buffer, and a jacket disposed around the braiding layer, the jacket having optical properties to receive LED light transmitted down the buffer in response to VCSEL light having been unsuccessfully transmitted down the core.

Abstract: The invention relates to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various different parts, which provide different levels of heat dissipation depending on the desired implementation, while maintaining a seal against EMI leakage. Extra heat sinking portions are provided to dissipate heat generated from specific heat generating sources. The extra heat sinking portions are configured into a shape and/or out of a material that provides more thermal dissipation than the standard cover provided. Independent control over the different heat sinking portions enables a better fit and appropriate dissipation.

Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

Abstract: The invention relates. to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various different parts, which provide different levels of heat dissipation depending on the desired implementation, while maintaining a seal against EMI leakage. Extra heat sinking portions are provided to dissipate heat generated from specific heat generating sources. The extra heat sinking portions are configured into a shape and/or out of a material that provides more thermal dissipation than the standard cover provided.

Abstract: A method and apparatus are provided for laser safety. A fault detector detects laser fault conditions and generates a laser fault control signal. A laser fault counter is coupled to the fault detector for counting laser fault conditions and for generating a disable laser control signal responsive to a predetermined fault count. A reset timer is coupled to the laser fault counter for identifying a predetermined reset time period responsive to the laser fault control signal and applying a reset signal to the laser fault counter. Features of laser safety method and apparatus of the invention are that the laser fault counter is reset if a second laser fault condition is not detected within the predetermined reset time period after the laser is turned on. The disable laser control signal is not generated when a safe laser optical power condition occurs between two laser fault conditions.

Abstract: An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters for performing conversions between both electrical and optical signals. A preferred embodiment of the invention contemplates fabricating the optical communication module on a single multilayer card with all the transmitter electrical components being located on one side of the card, all receiver electrical components being located on the other side of the card, and the transmitter and receiver components being separated by shielding layers in the card. By using two transmitter/receiver pairs (with the transmitters and receivers being located on respective sides of the card) an embodiment of the invention provides for double full duplex communications.

Abstract: An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters for performing conversions between both electrical and optical signals. The module further includes edge mounted optical components having leads mounted on the surface of a card (as opposed to standard pin-in-hole type leads) to minimize lead capacitance and inductance from the optical components to the card electronics, on board card control means for the converters and safety shut down means on the same card as the electrical and optical components.