Abstract: An electrolytic capacitor that is configured to be embedded into a circuit board is provided. The electrolytic capacitor contains a capacitor element, anode and cathode terminations, and a case that encapsulates the capacitor element and leaves at least a portion of the anode and cathode terminations exposed that extend outwardly from opposite ends of the case. Each of the terminations possesses an upper surface that faces toward the capacitor element and a lower surface that faces away from the capacitor element. In contrast to conventional surface-mounted electrolytic capacitors, the upper surfaces of these exposed anode and cathode termination portions are mounted to the circuit board. In this manner, the capacitor may essentially be mounted “upside down” so that some or all of its thickness becomes embedded within the board itself, thereby minimizing the height profile of the capacitor on the board.

Abstract: A surface-mountable electrolytic capacitor with improved volumetric efficiency includes an electrolytic capacitor element, anode and cathode terminations, an encapsulation material and external terminations. The capacitor element has first and second opposing end surfaces and an anode wire extending from the first end surface that is electrically connected to a first anode termination portion. A first cathode termination portion is conductively adhered to a surface of the capacitor element, and a second portion is perpendicular to the first portion and parallel to the second end surface of the capacitor element. Encapsulating material surrounds the capacitor element to form a device package that is subsequently diced to improve volumetric efficiency and optionally expose the anode and cathode terminations on opposing end surfaces. First and second external terminations may be formed over the exposed portions of anode and cathode terminations to wrap around to one or more given surfaces of the device package.

Abstract: A surface-mountable electrolytic capacitor with improved volumetric efficiency includes an electrolytic capacitor element, anode and cathode terminations, an encapsulation material and external terminations. The capacitor element has first and second opposing end surfaces and an anode wire extending from the first end surface that is electrically connected to a first anode termination portion. A first cathode termination portion is conductively adhered to a surface of the capacitor element, and a second portion is perpendicular to the first portion and parallel to the second end surface of the capacitor element. Encapsulating material surrounds the capacitor element to form a device package that is subsequently diced to improve volumetric efficiency and optionally expose the anode and cathode terminations on opposing end surfaces. First and second external terminations may be formed over the exposed portions of anode and cathode terminations to wrap around to one or more given surfaces of the device package.

Abstract: An electrolytic capacitor that is configured to be embedded into a circuit board is provided. The electrolytic capacitor contains a capacitor element, anode and cathode terminations, and a case that encapsulates the capacitor element and leaves at least a portion of the anode and cathode terminations exposed that extend outwardly from opposite ends of the case. Each of the terminations possesses an upper surface that faces toward the capacitor element and a lower surface that faces away from the capacitor element. In contrast to conventional surface-mounted electrolytic capacitors, the upper surfaces of these exposed anode and cathode termination portions are mounted to the circuit board. In this manner, the capacitor may essentially be mounted “upside down” so that some or all of its thickness becomes embedded within the board itself, thereby minimizing the height profile of the capacitor on the board.

Abstract: An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the capacitor assembly contains a first solid electrolytic capacitor element and second solid electrolytic capacitor element positioned adjacent to the first solid electrolytic capacitor element. The first and second solid electrolytic capacitor elements each contain an anode formed from a valve metal composition having a specific charge of about 70,000 ?F*V/g or more, the anode having a thickness of from about 0.1 to about 4 millimeters. A thermally conductive material is positioned between the first and second solid electrolytic capacitor elements and electrically connected thereto. The thermally conductive material has a coefficient of thermal conductivity of about 100 W/m-K or more at a temperature of 20° C. A case encapsulates the first and second solid electrolytic capacitor elements.

Abstract: An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the capacitor assembly contains a first solid electrolytic capacitor element and second solid electrolytic capacitor element positioned adjacent to the first solid electrolytic capacitor element. The first and second solid electrolytic capacitor elements each contain an anode formed from a valve metal composition having a specific charge of about 70,000 ?F*V/g or more, the anode having a thickness of from about 0.1 to about 4 millimeters. A thermally conductive material is positioned between the first and second solid electrolytic capacitor elements and electrically connected thereto. The thermally conductive material has a coefficient of thermal conductivity of about 100 W/m-K or more at a temperature of 20° C. A case encapsulates the first and second solid electrolytic capacitor elements.