Abstract: A method and associated pallet assembly for reflow soldering electrical interconnections between a pair of printed circuits, at least one of which features a relatively-low-softening-temperature substrate, includes fixturing the printed circuits between the mating surfaces of a pallet and a cover, wherein the cover includes a first aperture adapted to expose an area on the back face of the first printed circuit. When the palletized printed circuits are advanced through a reflow oven, a nozzle directs hot gases through the first aperture to impinge directly upon the back face of the substrate to thereby reflow a solder layer sandwiched between the respective substrates of the printed circuits. Additional components on the second printed circuit are advantageously soldered in the same pass as hot gases from the nozzle flow through a second aperture defined in the pallet assembly's cover to impinge upon an additional solder layer on the second printed circuit.