Patents by Inventor Lai Chang Fong

Lai Chang Fong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide compounds containing pitch carbon fiber
    Patent number: 9243178
    Abstract: A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix with pitch-based carbon fiber, boron nitride, and organophosphinate flame regardant dispersed in the matrix. The compound can be extruded or molded into a heat dissipating article.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: January 26, 2016
    Assignee: PolyOne Corporation
    Inventors: Haiyan Chen, Ching Lee Joseph Lim, Lai Chang Fong
  • POLYAMIDE COMPOUNDS CONTAINING PITCH CARBON FIBER
    Publication number: 20140166925
    Abstract: A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix with pitch-based carbon fiber, boron nitride, and organophosphinate flame regardant dispersed in the matrix. The compound can be extruded or molded into a heat dissipating article.
    Type: Application
    Filed: July 12, 2012
    Publication date: June 19, 2014
    Applicant: POLYONE CORPORATION
    Inventors: Haiyan Chen, Ching Lee Joseph Lim, Lai Chang Fong