Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: Disclosed is a hand-operated screw driver with high driving speed/high torque force alternative selection mechanism. A planet gear transmission mechanism is provided having a linking-up shaft and a transmission shaft at two opposite ends respectively alternatively coupled with a driving shaft, which is driven to rotate by a handle, and an output shaft, which drives a screw driver blade for turning screws. The planet gear transmission mechanism is received inside a casing and controlled to rotate by a shift control member to alternatively change the position of the linking-up shaft with the transmission shaft so as to reduce the torque force and increase the speed or reduce the speed and increase the torque force in driving a screw driver blade to turn a screw.