Abstract: A vertical Venetian blind comprises a head rail, a first end cover, a second end cover, a control seat, a plurality of slat transmission seats, a plurality of link pieces, and a transmission shaft. The control seat, the slat transmission seats, the link pieces, and the transmission shaft are assembled together as a whole and can be therefore separate together from the head rail in the event that the head rail must be adjusted in length. The slat transmission seats can be easily adjusted in number. The transmission shaft can be adjusted in length accordingly.

Abstract: A semiconductor package for fixed surface mounting is disclosed, such as QFN, SON. The package includes a die, an encapsulant body sealing the die, a die pad supporting the die, and a plurality of leads electrically connecting with the die. The surface of die pad exposing outside the encapsulant body has grooves formed for improving the surface mounting to a printed circuit board.

Abstract: An optical device with a tape carrier package is provided for low cost packaging and better stability. The optical device comprises: an optical sensor chip having a plurality of electrodes on its sensible surface; a flexible circuit board having an upside surface, an underside surface and a window; a plurality of metal circuits formed on the flexible circuit board and each of them having an inner lead extending into the window for bonding with the corresponding electrode; a base having a recession which is corresponding to the window and located under the underside surface of the flexible circuit board, and having a surrounding dam which extends onto the upside surface of the flexible circuit boars; and a transparent cover fixed attached to the surrounding dam for sealing the optical sensor chip.

Abstract: A method for underfilling bonding gap between flip-chip and circuit substrate is disclosed. A chip is mounted on a circuit substrate with flip-chip configuration. The circuit substrate has a top surface, a bottom surface, and a plurality of via holes. Some of the via holes are formed to be air vents passing through the top surface and the bottom surface. So that the underfill material flows into the gap between flip-chip and circuit substrate until jamming or blocking the said air vents rapidly while underfilling.

Abstract: A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a same plane. Between adjacent circuit boards there is a galley for passing through metal bonding wires to connect chip with circuit board and molding package body easily. The plurality of circuit boards together hold the chip so as to reduce thermal stress caused by CTE mismatch.