Abstract: An image display system includes a network server. The network server is configured to operate with a plurality of mobile devices and is configured to split a predetermined image into a plurality of sub-images corresponding in quantity to the plurality of mobile devices and respectively transmit each of the sub-images to one of the mobile devices that occupies a predetermined display position of a predetermined display region. Each of the mobile devices is configured to correspondingly display a sub-image transmitted thereto, and the plurality of sub-images displayed by the plurality of mobile devices collectively re-compose the predetermined image. An image display method is also provided.

Abstract: An image display system includes a network server. The network server is configured to operate with a plurality of mobile devices and is configured to split a predetermined image into a plurality of sub-images corresponding in quantity to the plurality of mobile devices and respectively transmit each of the sub-images to one of the mobile devices that occupies a predetermined display position of a predetermined display region. Each of the mobile devices is configured to correspondingly display a sub-Image transmitted thereto, and the plurality of sub-images displayed by the plurality of mobile devices collectively re-compose the predetermined image. An image display method is also provided.

Abstract: Techniques for testing a semiconductor wafer are disclosed. One technique includes measuring a parameter for each of the semiconductor dies in a region of the wafer and determining an adaptive threshold for the region based on the measured parameters. The parameter measured for each die in the region is then compared to the adaptive threshold to determine a qualification status for each die. Accordingly, the semiconductor dies of the wafer are qualified based on an adaptive threshold that varies according to the wafer region under test. This allows for detection of dies whose parameters vary significantly from other dies in a region, providing for detection of potentially faulty dies whose parameter measurements otherwise meet a fixed threshold set for the entire wafer, such as a Single Threshold Test Limit (STL) expectation for the wafer.

Abstract: Techniques for testing a semiconductor wafer are disclosed. One technique includes measuring a parameter for each of the semiconductor dies in a region of the wafer and determining an adaptive threshold for the region based on the measured parameters. The parameter measured for each die in the region is then compared to the adaptive threshold to determine a qualification status for each die. Accordingly, the semiconductor dies of the wafer are qualified based on an adaptive threshold that varies according to the wafer region under test. This allows for detection of dies whose parameters vary significantly from other dies in a region, providing for detection of potentially faulty dies whose parameter measurements otherwise meet a fixed threshold set for the entire wafer, such as a Single Threshold Test Limit (STL) expectation for the wafer.