Abstract: A method of bonding substrates includes steps as follows. Providing a curved glass substrate and a flexible light-transmissive film; moving a roller to press the flexible light-transmissive film onto the curved glass substrate so that the flexible light-transmissive film matches a curvature of the curved glass substrate to gradually fit and bond onto the curved glass substrate; sensing the attaching level of at least one local area of the flexible light-transmissive film bonded on the curved glass substrate; and adjusting a press force exerted by the roller to the local area of the flexible light-transmissive film according to the attaching level during the flexible light-transmissive film is bonded onto the curved glass substrate.

Abstract: A method of bonding substrates includes steps as follows. Providing a curved glass substrate and a flexible light-transmissive film; moving a roller to press the flexible light-transmissive film onto the curved glass substrate so that the flexible light-transmissive film matches a curvature of the curved glass substrate to gradually fit and bond onto the curved glass substrate; sensing the attaching level of at least one local area of the flexible light-transmissive film bonded on the curved glass substrate; and adjusting a press force exerted by the roller to the local area of the flexible light-transmissive film according to the attaching level during the flexible light-transmissive film is bonded onto the curved glass substrate.

Abstract: A glue-thermal curing equipment includes a chassis, a support, a heating baking plate and a lifting device. The chassis is formed with an accommodation space therein. The support is fixedly disposed in the accommodation space. The heating baking plate is disposed on the support, and has a top surface acting as a heat generating surface. The heat generating surface allows a panel device to be directly disposed thereon, and fully provides uniform thermal energy to a liquid-state glue layer disposed on the panel device. The lifting device is elevatably disposed on the support and enables the panel device to be lifted and separated from the heat generating surface.

Abstract: A glue-thermal curing equipment includes a chassis, a support, a heating baking plate and a lifting device. The chassis is formed with an accommodation space therein. The support is fixedly disposed in the accommodation space. The heating baking plate is disposed on the support, and has a top surface acting as a heat generating surface. The heat generating surface allows a panel device to be directly disposed thereon, and fully provides uniform thermal energy to a liquid-state glue layer disposed on the panel device. The lifting device is elevatably disposed on the support and enables the panel device to be lifted and separated from the heat generating surface.