Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: A microfluidic platform including a microfluidic layer and a contact layer. The microfluidic layer is embedded with a microfluidic structure including a micro-channel and a fluidic sample contained in the micro-channel. The contact layer is able to be attached to the microfluidic layer, and includes a first heater for heating a first area of the microfluidic structure to a first temperature and a second heater for heating a second area of the microfluidic structure to a second temperature. The microfluidic layer and the contact layer rotate together during operation. A method for controlling a sample in the micro-channel of the microfluidic structure.

Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: A method of manufacturing a lead frame includes, firstly, forming a metal plate which has a frame portion, a pad portion for mounting semiconductor elements, and lead portions. After that, the lead portions are etched to form a support end, a connecting terminal and a jointing end of each lead portion. Then a receiving portion for receiving the semiconductor elements is formed, wherein the receiving portion is collectively defined by the connecting terminals, the support ends and the pad portion. After that, step portions are formed on the lead portions and the pad portion by half-etching. A method of manufacturing a semiconductor package which includes the lead frame is also provided.

Abstract: A material consisting essentially of a vinyl thermoplastic polymer, un-functionalized carbon nanotubes and hydroxylated carbon nanotubes dissolved in a solvent. Un-functionalized carbon nanotube concentrations up to 30 wt % and hydroxylated carbon nanotube concentrations up to 40 wt % can be used with even small concentrations of each (less than 2 wt %) useful in producing enhanced conductivity properties of formed thin films.

Abstract: A package assembly includes a substrate, an electronic component, and an encapsulation body. The electronic component is located on the substrate and electrically connected to the substrate. The encapsulation body encapsulates the electronic component with the substrate. A portion of the substrate corresponding to the electronic component defines a plurality of through holes. A diameter of each of the plurality of through holes gradually reduces from a top surface of the substrate toward a bottom surface of the substrate. The plurality of through holes prevent melting remnants of the encapsulation body from flowing outside of the substrate.

Abstract: A microfluidic platform including a microfluidic layer and a contact layer. The microfluidic layer is embedded with a microfluidic structure including a micro-channel and a fluidic sample contained in the micro-channel. The contact layer is able to be attached to the microfluidic layer, and includes a first heater for heating a first area of the microfluidic structure to a first temperature and a second heater for heating a second area of the microfluidic structure to a second temperature. The microfluidic layer and the contact layer rotate together during operation. A method for controlling a sample in the micro-channel of the microfluidic structure.

Abstract: A jig assembly for selecting and presenting fastener nuts in the correct orientation, each fastener nut including a nut cap and an assembling portion formed on an end of the fastener nut. The diameter of the nut cap is larger than the diameter of the assembling portion. The jig assembly includes an electric cabinet, a jig bracket, a feed container, and a sorting tray. The feed container includes a selector with an opening. The width of the opening is equal to the height of the fastener nut, the first sidewall of the selector forms a plurality of restricting protrusions, and each two adjacent restricting protrusions cooperatively define a restricting groove therebetween. The width of each restricting groove is equal to the diameter of the assembling portion, thus only fastener nuts in the correct orientation are capable of passing through the selector to be collected in the sorting tray.

Abstract: The present invention is a method of making a composite polymeric material by dissolving a vinyl thermoplastic polymer, un-functionalized carbon nanotubes and hydroxylated carbon nanotubes and optionally additives in a solvent to make a solution and removing at least a portion of the solvent after casting onto a substrate to make thin films. The material has enhanced conductivity properties due to the blending of the un-functionalized and hydroxylated carbon nanotubes.

Abstract: A package assembly includes a substrate, an electronic component, and an encapsulation body. The electronic component is located on the substrate and electrically connected to the substrate. The encapsulation body encapsulates the electronic component with the substrate. A portion of the substrate corresponding to the electronic component defines a plurality of through holes. A diameter of each of the plurality of through holes gradually reduces from a top surface of the substrate toward a bottom surface of the substrate. The plurality of through holes prevent melting remnants of the encapsulation body from flowing outside of the substrate.

Abstract: A semiconductor package includes a lead frame, a first chip, a second chip, a plurality of bonding wires and a mold compound. The lead frame includes a pad portion at a center of the frame and a plurality of lead portions. The pad portion and the plurality of lead portions collectively define a receiving portion. The first chip is securely received in the receiving portion. The second chip is mechanically attached to the first chip. The plurality of bonding wires electrically connect the second chip to the plurality of lead portions. The mold compound encapsulates the lead frame, the first chip, the second chip and the plurality of bonding wires to form the semiconductor package.

Abstract: A method of manufacturing a lead frame includes, firstly, forming a metal plate which has a frame portion, a pad portion for mounting semiconductor elements, and lead portions. After that, the lead portions are etched to form a support end, a connecting terminal and a jointing end of each lead portion. Then a receiving portion for receiving the semiconductor elements is formed, wherein the receiving portion is collectively defined by the connecting terminals, the support ends and the pad portion. After that, step portions are formed on the lead portions and the pad portion by half-etching. A method of manufacturing a semiconductor package which includes the lead frame is also provided.

Abstract: The present invention is a method of making a composite polymeric material by dissolving a vinyl thermoplastic polymer, un-functionalized carbon nanotubes and hydroxylated carbon nanotubes and optionally additives in a solvent to make a solution and removing at least a portion of the solvent after casting onto a substrate to make thin films. The material has enhanced conductivity properties due to the blending of the un-functionalized and hydroxylated carbon nanotubes.

Abstract: A semiconductor package includes a lead frame, a first chip, a second chip, a plurality of bonding wires and a mold compound. The lead frame includes a pad portion at a center of the frame and a plurality of lead portions. The pad portion and the plurality of lead portions collectively define a receiving portion. The first chip is securely received in the receiving portion. The second chip is mechanically attached to the first chip. The plurality of bonding wires electrically connect the second chip to the plurality of lead portions. The mold compound encapsulates the lead frame, the first chip, the second chip and the plurality of bonding wires to form the semiconductor package.