Patents by Inventor LAIHONG ZHANG

LAIHONG ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12127598
    Abstract: An airflow sensor includes a sensing circuit module having a circuit board and a sensing component, a first sealing piece and a second sealing piece. The first sealing piece is disposed to cover at least a part of a first surface of the circuit board. The second sealing piece is disposed to cover at least a part of a second surface opposite to the first surface. A first accommodating cavity is formed between the first sealing piece and the circuit board. The sensing component is received in the first accommodating cavity. The first sealing piece includes a first waterproof air-permeable portion. A connecting soldering pad electrically connected with the sensing component is disposed at the circuit board. The airflow sensor is electrically connected with other circuitry components through the connecting soldering pad. The connecting soldering pad is not covered by either the first sealing piece or the second sealing piece.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: October 29, 2024
    Assignee: SHENZHEN FIRST UNION TECHNOLOGY CO., LTD.
    Inventors: Jing Yang, Laihong Zhang, Zhongli Xu, Yonghai Li
  • Publication number: 20220361584
    Abstract: An airflow sensor includes a sensing circuit module having a circuit board and a sensing component, a first sealing piece and a second sealing piece. The first sealing piece is disposed to cover at least a part of a first surface of the circuit board. The second sealing piece is disposed to cover at least a part of a second surface opposite to the first surface. A first accommodating cavity is formed between the first sealing piece and the circuit board. The sensing component is received in the first accommodating cavity. The first sealing piece includes a first waterproof air-permeable portion. A connecting soldering pad electrically connected with the sensing component is disposed at the circuit board. The airflow sensor is electrically connected with other circuitry components through the connecting soldering pad. The connecting soldering pad is not covered by either the first sealing piece or the second sealing piece.
    Type: Application
    Filed: September 25, 2020
    Publication date: November 17, 2022
    Inventors: JING YANG, LAIHONG ZHANG, ZHONGLI XU, YONGHAI LI