Abstract: In a first aspect, a multilayer film includes a polymer substrate having a glass transition temperature of 240° C. or higher, a release layer adhered to the polymer substrate and a polyimide film layer releasably adhered to the release layer on a side opposite the polymer substrate. The release layer includes a cross-linked silicone having a decomposition temperature of 350° C. or higher. The polyimide film layer has a thickness of 10 ?m or less. In a second aspect, a polyimide film having a thickness of 10 ?m or less is derived from the multilayer film of the first aspect. In a third aspect. a coverlay package includes the multilayer film of the first aspect, an adhesive layer adhered to the polyimide film layer on a side opposite the release layer, and a release film releasably adhered to the adhesive layer on a side opposite the polyimide film layer.

Abstract: In a first aspect, a current collector includes a polymer film, a first metal layer adhered to the polymer film, and a second metal layer adhered to the polymer film on a side opposite the first metal layer. The polymer film includes an electrically conductive filler and has a surface resistivity of 1 Megaohm/square or less. The first and second metal layers each have a thickness of 3 ?m or less. The current collector has a mid-discharge voltage that is at least 20% lower when compared to an untreated battery-grade copper foil, based on a standard lithium-ion battery half-cell test at a temperature of 25° C. and discharge rate of 2 C or greater.

Abstract: In a first aspect, a clad includes a polymer film and a first metal layer adhered to the polymer film. The polymer film includes an electrically conductive filler and has a surface resistivity of 1 Megaohm/square or less. The first metal layer has a thickness of 100 ?m or less. The clad has less than 15 ppm of Pd. The metal layer is formed on the polymer film by directly electrochemically depositing the first metal layer on the polymer film.

Abstract: In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 7 ?m or more, an L* of 33 or less and a 60° gloss of 10 or less.

Abstract: In a first aspect, a polyimide film includes a substantially chemically converted polyimide and at least 10 volume percent of an inorganic filler, based on a total volume of the polyimide film. A void ratio of the polyimide film is 0.75 or less. In a second aspect, a polyimide film includes a substantially chemically converted polyimide and at least 10 volume percent of an organic filler, based on a total volume of the polyimide film. A void ratio of the polyimide film is 1.0 or less.

Abstract: In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 6 ?m or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.

Abstract: In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 6 ?m or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.

Abstract: In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 7 ?m or more, an L* of 33 or less and a 60° gloss of 10 or less.