Abstract: A soldering tool for holding wires together such that solder may be applied. The soldering tool includes a pliers comprising a pair of elongated members pivotally coupled together and each having a first end and a second end. Proximal portions of the elongate members comprise a non-heat conducting material, and distal portions of the elongate members comprise a heat conducting material. Each of the second ends has an opening extending therein. A plurality of heat conducting heads is removably attachable to the pliers. Each of the heads comprises a pair of jaw portions, each having a first end and a second end. The first ends each have a rod attached thereto removably extendable into one of the female couplers for frictionally coupling the jaw portions to the elongate member. An electric heating means is in communication with the distal portions of the elongated members.