Abstract: An integrated circuit may include a plurality of input/output (I/O) cells used for communicating signals, power, and ground to and from a core of the integrated circuit. The I/O cells may each include a bond pad formed in one or more top metal layers. One or more of the bond pads may be offset a predetermined distance from an I/O cell edge corresponding to a chip edge of the integrated circuit. A volume may be determined by the I/O cell edge and the predetermined distance and one or more rails may be disposed in the volume and in at least one metal layer common with at least one metal layer of the bond pad. The rails may be involved in the discharge of electrostatic discharge (ESD) current, and may reduce path resistance of the path used to discharge the ESD current.

Abstract: An integrated circuit (“IC”) includes an input receiver with multiple hysteresis levels. An exemplary input receiver may be an input buffer with a Schmitt trigger that has multiple hysteresis windows between different high and low input voltages. This circuit may improve the input noise immunity of the external input signals and timing by allowing for a selection one of the plurality of levels depending on parameters of the input (e.g. noise level).

Abstract: An integrated circuit may include a plurality of input/output (I/O) cells used for communicating signals, power, and ground to and from a core of the integrated circuit. The I/O cells may each include a bond pad formed in one or more top metal layers. One or more of the bond pads may be offset a predetermined distance from an I/O cell edge corresponding to a chip edge of the integrated circuit. A volume may be determined by the I/O cell edge and the predetermined distance and one or more rails may be disposed in the volume and in at least one metal layer common with at least one metal layer of the bond pad. The rails may be involved in the discharge of electrostatic discharge (ESD) current, and may reduce path resistance of the path used to discharge the ESD current.

Abstract: An integrated circuit (“IC”) includes an input receiver with multiple hysteresis levels. An exemplary input receiver may be an input buffer with a Schmitt trigger that has multiple hysteresis windows between different high and low input voltages. This circuit may improve the input noise immunity of the external input signals and timing by allowing for a selection one of the plurality of levels depending on parameters of the input (e.g. noise level).

Abstract: A memory system or flash card may include a controller interface for communicating with a host. The interface utilizes multiple pre-driver logic blocks that are tolerant to different voltages. For example, one block may use gate oxide devices tolerant to IO low voltage that speed up the delay path during low voltage operation, while a second block may use gate oxide devices tolerant to IO higher voltage for backwards compatibility with devices that operate at a high IO voltage. This allows the interface to take advantage of the IO low voltage device speed for multi-purpose IO use, while still being used for both low voltage and higher voltage protocols.

Abstract: An interface for use of device whose core circuitry operates in one voltage domain, but exchanges signal with another device (or “host”) according a different voltage domain, and the use of such an interface for supplying data using a double data rate (DDR) transfer, is presented. One concrete example of this situation is a memory card, where the internal circuitry uses one voltage range for its core operating voltages, but exchanges signals with a host using different, input/output voltage range. According to a general set of aspects, the interface receives data signals from the device at the device's core operating voltage domain, individually level shifts these to the input/output voltage domain, and then combines them into a DDR signal for transfer to the host device, where a (non-level shifted) clock signal from the host device is used as the select signal to form the DDR data signal.

Abstract: An integrated circuit (IC) includes an output driver circuit portion that is electrically configurable, via a configuration input, to operate in either a first mode or a second mode corresponding to an indication of a condition of the IC, such as a supply voltage indication, the first mode and the second mode having different drive characteristics. A configuration interface circuit portion as part of the improved IC is adapted to selectively override the configuration input to configure operation of the output driver circuit portion in either the first mode or the second mode based on a drive strength control input, regardless of the condition of the IC.

Abstract: An integrated circuit (IC) includes an output driver circuit portion that is electrically configurable, via a configuration input, to operate in either a first mode or a second mode corresponding to an indication of a condition of the IC, such as a supply voltage indication, the first mode and the second mode having different drive characteristics. A configuration interface circuit portion as part of the improved IC is adapted to selectively override the configuration input to configure operation of the output driver circuit portion in either the first mode or the second mode based on a drive strength control input, regardless of the condition of the IC.