Abstract: An inkjet printhead includes a plurality of ink chambers fed by a common ink inlet, the plurality of ink chambers sharing a common roof structure; a plurality of heater elements respectively allocated to each of ink chambers; a plurality of nozzle apertures defined through the common roof structure and respectively aligned with the heater element of each ink chamber; and a bubble vent defined in the common roof of the ink chambers and aligned with the common ink inlet, the bubble vent sized to allow ink surface tension to restrict an egress of ink, and permit egress of gas bubbles therefrom.

Abstract: An inkjet printer includes a printhead having a plurality of ink chambers fed be an ink inlet, each ink chamber having a heater element for ejecting drops of ink from a nozzle aperture of each chamber; a plurality of pressure pulse diffusing structure positioned between the plurality of ink chambers fed by the ink inlet, the plurality of pressure pulse diffusing structures for retarding a propagation of pressure waves generated by each ink chamber to adjacent ink chambers; and a controller for receiving print data and generating drive pulses to energize the heater elements in accordance with the print data. The controller increases the drive pulse energy during the printhead lifetime such that the drive pulse energy is never less than that of a preceding drive pulse.

Abstract: An inkjet printhead with a resistive heaters for vaporizing ink to eject drops through respective nozzles. The heater is formed from a TiAlX alloy where Ti contributes more than 40% by weight, Al contributes more than 40% by weight and X contributes less than 5% by weight and comprises zero or more of Ag, Cr, Mo, Nb, Si, Ta and W.

Abstract: A method of photoresist removal is provided. The method employs a plasma formed from a gas chemistry comprising NH3. The method is particularly suitable for use in MEMS fabrication processes, such as inkjet printhead fabrication.

Abstract: A method of etching a metal by a reactive ion etching process is provided. The etchant gas chemistry for the reactive ion etching process consists essentially of NH3. The process is particularly suitable for etching superalloys, which etch only slowly using conventional metal etching techniques.

Abstract: An inkjet printer that has a printhead with an array of ejection devices for ejecting drops of liquid onto a media substrate. Each of the ejection devices having a chamber for holding liquid, a nozzle in fluid communication with the chamber and a heater positioned in the chamber for contact with the liquid such that resistive heating of the heater generates a vapour bubble that ejects a drop of the liquid through the nozzle. The printer also has a controller for receiving print data and generating drive pulses to energize the heaters in accordance with the print data. The controller increases the drive pulse energy during the printhead lifetime.

Abstract: A MEMS vapor bubble generator with a chamber for holding liquid and a heater positioned in the chamber for heating the liquid above its bubble nucleation point to form a vapour bubble; wherein, the heater is formed from a superalloy.

Abstract: A MEMS vapor bubble generator with a chamber for holding liquid and a heater positioned in the chamber for heating the liquid above its bubble nucleation point to form a vapour bubble; wherein, the heater has a microstructure with a grain size less than 100 nanometres.