Patents by Inventor Lakshmi Durbha

Lakshmi Durbha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of editing a semiconductor die
    Patent number: 7352001
    Abstract: Resistance and capacitance are added to a prototype die to fix or identify performance issues with the integrated circuit formed in the die by forming a thin piece of silicon on the top surface of the die. For resistance, vias are formed to regions on the metal traces and to opposite ends of the piece of silicon using a FIB system. For capacitance, a dielectric is formed on the piece of silicon, and a layer of metal is formed on the dielectric. Vias are formed to regions on the metal traces, to the piece of silicon, and to the layer of metal using the FIB system.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: April 1, 2008
    Assignee: National Semiconductor Corporation
    Inventors: Kevin Weaver, Henry Acedo, Lakshmi Durbha
  • Semiconductor die with an editing structure
    Patent number: 7087927
    Abstract: Resistance and capacitance are added to a prototype die to fix or identify performance issues with the integrated circuit formed in the die by forming a thin piece of silicon on the top surface of the die. For resistance, vias are formed to regions on the metal traces and to opposite ends of the piece of silicon using a FIB system. For capacitance, a dielectric is formed on the piece of silicon, and a layer of metal is formed on the dielectric. Vias are formed to regions on the metal traces, to the piece of silicon, and to the layer of metal using the FIB system.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: August 8, 2006
    Assignee: National Semiconductor Corporation
    Inventors: Kevin Weaver, Henry Acedo, Lakshmi Durbha