Abstract: A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired.

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.

Abstract: NiW and NiFe microstructure alloys and other microstructure alloys are disclosed, along with a method of making those structures. The microstructures may have heights of 500 &mgr;m or greater, and the alloy composition may have a controllable gradient if it is desired to impart different properties to different parts of a structure. The microstructures are harder than conventional nickel microstructures, and have lower coefficients of thermal expansion. While both types of alloyed microdevices have improved hardness and reduced coefficients of thermal expansion, the NiW alloys may be primarily used where increased hardness is important, for example micro-gears and other microdevices with moving parts that would benefit from increased hardness at points of contact; while the NiFe alloys may be primarily used where a small coefficient of thermal expansion is desirable. The techniques are especially useful for plating NiW or NiFe into deep recesses of a microstructure.