Patents by Inventor Lakshminarayanan Striramassarma

Lakshminarayanan Striramassarma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10909039
    Abstract: Embodiments are generally directed to data prefetching for graphics data processing. An embodiment of an apparatus includes one or more processors including one or more graphics processing units (GPUs); and a plurality of caches to provide storage for the one or more GPUs, the plurality of caches including at least an L1 cache and an L3 cache, wherein the apparatus to provide intelligent prefetching of data by a prefetcher of a first GPU of the one or more GPUs including measuring a hit rate for the L1 cache; upon determining that the hit rate for the L1 cache is equal to or greater than a threshold value, limiting a prefetch of data to storage in the L3 cache, and upon determining that the hit rate for the L1 cache is less than a threshold value, allowing the prefetch of data to the L1 cache.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: February 2, 2021
    Assignee: INTEL CORPORATION
    Inventors: Vikranth Vemulapalli, Lakshminarayanan Striramassarma, Mike MacPherson, Aravindh Anantaraman, Ben Ashbaugh, Murali Ramadoss, William B. Sadler, Jonathan Pearce, Scott Janus, Brent Insko, Vasanth Ranganathan, Kamal Sinha, Arthur Hunter, Jr., Prasoonkumar Surti, Nicolas Galoppo von Borries, Joydeep Ray, Abhishek R. Appu, ElMoustapha Ould-Ahmed-Vall, Altug Koker, Sungye Kim, Subramaniam Maiyuran, Valentin Andrei
  • Patent number: 10909652
    Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: February 2, 2021
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
  • Patent number: 10803548
    Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: October 13, 2020
    Assignee: Intel Corporation
    Inventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
  • Patent number: 10802967
    Abstract: Embodiments described herein provide a general purpose graphics processor comprising a plurality of tiles, each tile of the plurality of tiles comprising at least one execution unit, a local cache, and a cache control unit, and a high bandwidth memory communicatively coupled to the plurality of tiles, wherein the high bandwidth memory is shared between the plurality of tiles. The cache control unit is to implement a partial write management protocol to receive a partial write operation directed to a cache line in the local cache, the partial write operation comprising write data, write the data associated with the partial write operation to the local cache when the cache line is in a modified state, and forward the write data associated with the partial write operation to the high bandwidth memory when the partial write operation triggers a cache miss or when the cache line is in an exclusive state or a shared state. Other embodiments may be described and claimed.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: October 13, 2020
    Assignee: INTEL CORPORATION
    Inventors: Joydeep Ray, James Valerio, Ben Ashbaugh, Lakshminarayanan Striramassarma
  • Patent number: 10783084
    Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: September 22, 2020
    Assignee: Intel Corporation
    Inventors: Abhishek R. Appu, Atlug Koker, Joydeep Ray, David Puffer, Prasoonkumar Surti, Lakshminarayanan Striramassarma, Vasanth Ranganathan, Kiran C. Veernapu, Balaji Vembu, Pattabhiraman K
  • Publication number: 20200294181
    Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Applicant: Intel Corporation
    Inventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
  • Publication number: 20200294180
    Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
  • Publication number: 20200294301
    Abstract: Embodiments are generally directed to multi-tile graphics processor rendering. An embodiment of an apparatus includes a memory for storage of data; and one or more processors including a graphics processing unit (GPU) to process data, wherein the GPU includes a plurality of GPU tiles, wherein, upon geometric data being assigned to each of a plurality of screen tiles, the apparatus is to transfer the geometric data to the plurality of GPU tiles.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Applicant: Intel Corporation
    Inventors: Prasoonkumar Surti, Arthur Hunter, JR., Kamal Sinha, Scott Janus, Brent Insko, Vasanth Ranganathan, Lakshminarayanan Striramassarma
  • Publication number: 20200293450
    Abstract: Embodiments are generally directed to data prefetching for graphics data processing. An embodiment of an apparatus includes one or more processors including one or more graphics processing units (GPUs); and a plurality of caches to provide storage for the one or more GPUs, the plurality of caches including at least an L1 cache and an L3 cache, wherein the apparatus to provide intelligent prefetching of data by a prefetcher of a first GPU of the one or more GPUs including measuring a hit rate for the L1 cache; upon determining that the hit rate for the L1 cache is equal to or greater than a threshold value, limiting a prefetch of data to storage in the L3 cache, and upon determining that the hit rate for the L1 cache is less than a threshold value, allowing the prefetch of data to the L1 cache.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Applicant: Intel Corporation
    Inventors: Vikranth Vemulapalli, Lakshminarayanan Striramassarma, Mike MacPherson, Aravindh Anantaraman, Ben Ashbaugh, Murali Ramadoss, William B. Sadler, Jonathan Pearce, Scott Janus, Brent Insko, Vasanth Ranganathan, Kamal Sinha, Arthur Hunter, JR., Prasoonkumar Surti, Nicolas Galoppo von Borries, Joydeep Ray, Abhishek R. Appu, ElMoustapha Ould-Ahmed-Vall, Altug Koker, Sungye Kim, Subramaniam Maiyuran, Valentin Andrei
  • Publication number: 20200183849
    Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 11, 2020
    Applicant: Intel Corporation
    Inventors: Abhishek R. Appu, Altug Koker, Joydeep Ray, David Puffer, Prasoonkumar Surti, Lakshminarayanan Striramassarma, Vasanth Ranganathan, Kiran C. Veernapu, Balaji Vembu, Pattabhiraman K
  • Patent number: 10580109
    Abstract: One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: March 3, 2020
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Patent number: 10503652
    Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: April 1, 2017
    Date of Patent: December 10, 2019
    Assignee: INTEL CORPORATION
    Inventors: Abhishek R. Appu, Altug Koker, Joydeep Ray, David Puffer, Prasoonkumar Surti, Lakshminarayanan Striramassarma, Vasanth Ranganathan, Kiran C. Veernapu, Balaji Vembu, Pattabhiraman K
  • Publication number: 20190272615
    Abstract: One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
    Type: Application
    Filed: May 21, 2019
    Publication date: September 5, 2019
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Patent number: 10346946
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: July 9, 2019
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Publication number: 20190012762
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 10, 2019
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Patent number: 10102604
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: October 16, 2018
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Publication number: 20180285278
    Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: April 1, 2017
    Publication date: October 4, 2018
    Applicant: Intel Corporation
    Inventors: Abhishek R. Appu, Altug Koker, Joydeep Ray, David Puffer, Prasoonkumar Surti, Lakshminarayanan Striramassarma, Vasanth Ranganathan, Kiran C. Veernapu, Balaji Vembu, Pattabhiraman K
  • Publication number: 20160284046
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Application
    Filed: March 29, 2016
    Publication date: September 29, 2016
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Patent number: 9330433
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: May 3, 2016
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali
  • Publication number: 20150379670
    Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Altug Koker, Lakshminarayanan Striramassarma, Akif Ali