Patents by Inventor Lam Campbell

Lam Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8269399
    Abstract: A sensor assembly includes a transducer and a control module coupled with the transducer. The control module is configured to selectively switch the sensor assembly between a first mode of operation wherein the sensor assembly measures an amount of energy induced to the sensor assembly, and a second mode of operation wherein the sensor assembly stores an amount of energy induced to the sensor assembly.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: September 18, 2012
    Assignee: General Electric Company
    Inventor: Lam Campbell
  • Publication number: 20110278986
    Abstract: A sensor assembly includes a transducer and a control module coupled with the transducer. The control module is configured to selectively switch the sensor assembly between a first mode of operation wherein the sensor assembly measures an amount of energy induced to the sensor assembly, and a second mode of operation wherein the sensor assembly stores an amount of energy induced to the sensor assembly.
    Type: Application
    Filed: May 13, 2010
    Publication date: November 17, 2011
    Inventor: Lam Campbell
  • Patent number: 7325455
    Abstract: An integral connectorless hermetically sealed high-temperature piezoelectric sensor housing and cable assembly includes signal conditioning/processing circuitry having a charge amplifier-differential amplifier combination with integral trim capacitor and/or a voltage divider network in at least one signal processing path to provide the ability to custom adjust input impedances and balance common-mode signals to compensate for inequalities caused by inherent parasitic capacitances and specific structural constraints of the sensor assembly.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: February 5, 2008
    Assignee: General Electric Company
    Inventors: Lam Campbell, Nicola Fulciniti, Michael J. Traphagen
  • Publication number: 20070101814
    Abstract: An integral connectorless hermetically sealed high-temperature piezoelectric sensor housing and cable assembly includes signal conditioning/processing circuitry having a charge amplifier-differential amplifier combination with integral trim capacitor and/or a voltage divider network in at least one signal processing path to provide the ability to custom adjust input impedances and balance common-mode signals to compensate for inequalities caused by inherent parasitic capacitances and specific structural constraints of the sensor assembly.
    Type: Application
    Filed: November 8, 2005
    Publication date: May 10, 2007
    Inventors: Lam Campbell, Nicola Fulciniti, Michael Traphagen