Abstract: A differential thickness stencil (14') integrally formed from two sieves (601 and 602) having different thicknesses (701 and 702) for a two-stage solder printing process for printing the solder mask for a fine-pitch component alongside that of a larger component. The differential thickness stencil (14') includes a first sieve (602) having at least one through-hole (142) of a first height (702) from a top surface portion (722) of the stencil to the bottom surface (714) of the stencil. This first sieve (702) has at least one inverted well (742) having an opening on the bottom surface (744) and having a second height (746) lower than the first height (702) starting from the bottom surface (714) to an underside ceiling (746) of the top surface of the stencil.

Abstract: A stencil shifter (800) for positioning a differential thickness stencil stencil (14' integrally formed from two sieves (601 and 602) having different thicknesses (701 and 702) for a two-stage solder printing process for printing the solder mask for a fine-pitch component alongside that of a larger component on the same side of a printed circuit board. This same stencil shifter (800) can also be used for a top and bottom side two-stage printing process. This two-stage printing process uses an integral stencil (814) having a plurality of sieves (801 and 802), the plurality of sieves including at least a first sieve (801) for paste stenciling a first side (191) of a board and a second sieve (802) for paste stenciling a second side (202) of the board. What side the board is facing is first determined by an optical sensor (193) and in response to the side detected, the integral stencil (814) is positioned to locate one of the pluralities of sieves over the board for printing that side.