Abstract: A magnetoresistive sensor system includes a plurality of chip carriers, such that each integrated circuit among the plurality of chip carriers is associated with a respective magnetoresistive sensing components. A plurality of magnetoresistive sensing components can be arranged in an array, wherein each magnetoresistive component among the plurality of magnetoresistive components is associated with a respective integrated circuit among the plurality of chip carriers and wherein the plurality of magnetoresistive sensing components comprises sensing components that are spaced irregular from one another in order to optimize the performance of the array and meet requirements of a particular magnetoresistive sensing application.

Abstract: A packing method and system for measuring multiple measurands including bi-directional flow comprises of sampling ports arranged within a flow tube in a symmetrical pattern. The ports are arranged symmetrically with respect to the X and Y centerlines of the flow tube. In addition, the ports are also arranged symmetrical to the restrictor to minimize the amount of turbulent flow within the flow tube.

Abstract: A pressure sensor apparatus and a method of forming the same. A substrate (e.g., PCB) can be provided that includes a top side and a bottom side. A pressure transducer can be directly bonded to the top side of the substrate, wherein the substrate comprises substrate walls forming a plated through-hole that allows for the passage of a sensed media to contact a back side of the pressure transducer. Thereafter, a metal carrier with an integral port is bonded to the bottom side of the substrate, thereby forming a chip-on-board pressure sensor in which the need for a plating or coating to allow adhesion between the pressure transducer and the metal carrier is eliminated. The pressure transducer may comprise, for example, silicon or silicon bonded to glass. The metal carrier can be provided with a feature that mates with a valve such as a Schrader valve.

Abstract: A pressure sensor port apparatus and method comprising a pressure port that includes a hexagonal area preferably comprising a plastic material (e.g., thermoplastic). Additionally, one or more electronic interconnections can be associated with the pressure sensor port, such that the electronic interconnections are isolated from sensed media while providing a pressure sensor port apparatus based on a cost effective injection molding process rather than a machining processes required for a metal.

Abstract: A microelectronic packaging method and system for minimizing the distance between the sensing plane of a MEMS flow sensor and a mounting substrate thereof. Flow obstructions are minimized and laminar flow maintained in order to enhance flow sensor optimal performance. The distance between the sensing plane and the mounting substrate can be controlled by optimizing the dimensions of an associated carrier with respect to the thickness of the MEMS flow sensor. Ideally, the sensing plane of the MEMS flow sensor is located at the same level as the mounting substrate or just slightly higher.

Abstract: A sensor includes one or more sensor transducers coupled with a signal conditioning IC incorporating signal conditioning circuitry and memory devoted to storing end-user downloadable coefficients. In a preferred embodiment, the IC is an ASIC and the end-user downloadable coefficients are pre-selected by the end-user based on its needs, and the coefficients are pre-stored in the ASIC when the sensor is calibrated. This results in a more cost-effective and space-efficient sensor device with improved functionality over that available in the prior art.

Abstract: A signal conditioning integrated circuit includes both signal conditioning circuitry and memory devoted to storing end-user downloadable coefficients. In a preferred embodiment, the integrated circuit is an Application Specific Integrated Circuit (ASIC), and the end-user downloadable coefficients, based upon a mathematical equation pre-selected by the end-user, are pre-stored in the ASIC when a sensor device with which the ASIC is associated is calibrated. This results in a customized and more cost-effective and space-efficient signal-conditioning apparatus with improved functionality over that available in the prior art.

Abstract: A method and apparatus for configuring a pressure sensor. A homogeneous piece of metal can be provided. A pressure port and a machined diaphragm are integrated onto the homogeneous piece of metal, wherein the machined diaphragm is connected to the pressure port. The machined diaphragm can be configured utilizing Advanced Thick Film (ATF) technology, thereby providing a high-pressure pressure sensor for use in high-pressure sensing application based on the pressure port and the machined diaphragm and related pressure sensor components thereof.

Abstract: A position detection system and method for linear and rotary sensing applications are disclosed herein, including a plurality of magnetoresistive sensing components for linear and rotary detection sensing, and an integrated circuit for amplifying and calibrating signals generated by the magnetoresistive sensing components in order to provide a full digital calibration and a ratio-metric output voltage or digital output signal indicative of linear and rotary position data.

Abstract: Sensor systems and methods are disclosed, including first and second sensing elements element co-located on a leadframe structure with respect to a particular target. In general, target-specific sensing applications can be determined by varying the distance between the first and second sensing elements on the leadframe structure with respect to a common datum point thereof in order to provide speed and direction detection data from the first and second sensing elements with respect to the particular target.

Abstract: A Hall-effect sensor apparatus, system and method. In general, a substrate having a surface can be provided. A plurality of Hall-effect sensing elements can then be configured upon the substrate, such that the centerline of a sensing plane associated with the plurality of Hall-effect sensing elements is located towards the surface of substrate, which results in a reduction of the distance between the centerline of the plane of the plurality of Hall-effect sensing elements and an axis of rotation of an associated bias magnet, thereby optimizing the location of the plurality of Hall-effect sensing elements and minimizing sensitivity to misposition and an increase in sensing accuracy.

Abstract: A magnetic sensing method and system include a die comprising a central location thereof. A group of magnetoresistive bridge circuits are located and configured upon the die. A magnetic biasing component is then utilized to bias the plurality of magnetoresistive bridge circuits with a magnetic field rotating about an axis of the central location of the die in order to generate a plurality of bridge output signals thereof. Finally, the plurality of bridge output signals are processed in order to determine position data thereof.

Abstract: Methods and systems are disclosed in which the errors caused by thermal expansion in magnetoresistive position transducers are reduced by predicting the physical alterations over temperature between centerline-to-centerline distances of particular magnetoresistive sensors or components within a magnetoresistive array and also between such an array and a magnet being sensed caused by thermal expansion.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit.

Abstract: A geartooth sensor utilizes an algorithm for establishing an adaptive threshold for the switch point of the sensor to minimize drift in the point at which the sensor output changes in relation to the target features it is tracking. The algorithm utilizes measured waveform peak and average outputs and applies a separate empirically derived constant to each value to quickly obtain the major portion of the adaptive threshold value from the product of the first constant and the peak output, and to refine the threshold value further with the product of the second constant and the average output.

Abstract: A geartooth sensor is provided with a carrier shaped to form a cavity in which semiconductor chips can be disposed. The carrier partially encapsulates a permanent magnet and a lead assembly. Unencapsulated portions of the lead assembly are exposed within the cavity to permit semiconductor components to be attached to a portion of the lead assembly. A cover is attached to the carrier to seal the cavity and protect the magnetically sensitive components located therein. The carrier, with its associated lead assembly and permanent magnet, can then be attached to a printed circuit board and a support structure to form a geartooth sensor. A protective enclosure can be disposed over the sensitive components of the geartooth sensor.