Abstract: A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.

Abstract: Methods and devices for increasing a sensor resolution are disclosed. In one example, a two measurement process is used. A first measurement is used to effectively measure across a full range (e.g. 0 to 5 VDC) of the sensor. This first measurement may identify the current operating point of the sensor (e.g. 3.5 VDC). A second measurement may then be made to effectively measure across a sub-range of the sensor that encompasses the current operating point of the sensor (e.g. across a sub-range of 3.0 to 4.0 VDC for a current operating point of 3.5 VDC). The gain of the amplifier may be raised during the second measurement to produce a higher resolution measurement. In some cases, the first measurement may be used to determine an appropriate offset that may be applied so as to scale the amplifier to the desired sub-range of sensor that includes the current operating point of the sensor. In some cases, the two measurements may be used together to compute an effectively higher resolution measurement signal.

Abstract: Flow sensor assemblies having increased flow range capabilities are disclosed. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port, an outlet flow port, and a fluid channel extending between the inlet flow port and the outlet flow port. One or more partitions are provided in the fluid channel of the housing to define two or more fluid sub-passages. A flow sensor, for sensing a measure related to a flow rate of a fluid flowing through the fluid channel, is positioned in one of the two or more fluid sub-passages. In some cases, the cross-sectional area of each of the two or more fluid sub-passages may be substantially the same, but this is not required. The housing may be formed from a single molded part defining the inlet and outlet flow ports, at least a portion of the fluid channel, and one or more of the partitions. In this case, a top cover may be provided and mounted to the housing to define the remaining portion of the fluid channel, if desired.

Abstract: Flow sensor assemblies having increased flow range capabilities are disclosed. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port, an outlet flow port, a fluid channel extending between the inlet flow port and the outlet flow port, and a bypass channel having a pair of taps fluidly connected to the fluid channel at separate locations. A flow sensor for sensing a measure related to a flow rate of a fluid flowing through the fluid channel can positioned in the bypass channel. A pressure differential between the two taps of the bypass channel can drive a fraction of a fluid flowing through the fluid channel through the bypass channel. The flow sensor assembly may be configured to achieve, control, and/or balance a desired fraction of fluid flow through the bypass channel and past the flow sensor.

Abstract: Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.

Abstract: A flow sensor apparatus and method. A seal with a conductive interconnect is provided that includes a mass flow sense element mounted to a housing containing a thick film and/or thin film bridge structure for sensing media (e.g., mass flow) within a flow tube. The seal effectively isolates wirebond pads and electrical connections from the sensed media. The media, whether liquid or gas, can contain ionics that eventually contaminate the top of the mass flow sense element. The use of the seal with the conductive interconnect thus seals off the electrical connections and prevents exposure to the sensed media.

Abstract: A sensing system that produces a multi-dynamic range output is provided. In an illustrative embodiment, a first channel and a second channel receive an analog output signal from a sensing element. The first channel provides a first digital output signal that has a first dynamic range, and the second channel provides a second digital output signal that has a second narrower dynamic range. In some cases, the second narrower dynamic range falls within the first dynamic range, and the first digital output signal may provide a first resolution and the second digital output signal may provide a second greater resolution. The dynamic range and/or resolution of one or more of the first channel and second channel may be dynamically reconfigurable, if desired.

Abstract: A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.

Abstract: A flow sensor apparatus and method. A seal with a conductive interconnect is provided that includes a mass flow sense element mounted to a housing containing a thick film and/or thin film bridge structure for sensing media (e.g., mass flow) within a flow tube. The seal effectively isolates wirebond pads and electrical connections from the sensed media. The media, whether liquid or gas, can contain ionics that eventually contaminate the top of the mass flow sense element. The use of the seal with the conductive interconnect thus seals off the electrical connections and prevents exposure to the sensed media.

Abstract: A pressure sensing apparatus (1) includes an elastically deformable pressure-sensitive diaphragm assembly (13) having a pressure-sensitive metal or metal alloy diaphragm (14). A functional filled dielectric layer (25) is on the diaphragm and includes a base dielectric material and at least one CTE raising filler. A CTE of the functional filled dielectric layer provides a CTE @ 800° C.?8 ppm/° C., such as ?10 ppm/° C. A plurality of piezoresistive elements (27) are on the functional filled dielectric layer (25).

Abstract: A method for forming a common mode filter for an electronic sensor and a common mode filter apparatus thereof is disclosed. A common mode filter may be molded across electrical conductors associated with the electronic sensor to thereby provide an enhanced EMC performance for the electronic sensor. The common mode filter is thus integrated with the electronic sensor rather than implemented as a separate common mode filter component. The common mode filter may comprise a ferrite filter molded across the electrical conductors associated with the electronic sensor. The electrical conductors may comprise electrical components such as, for example, a leadframe or leadwires associated with the electronic sensor. Additionally, the common mode filter can be configured as a pre-molded tie bar. Such a pre-molded tie bar may be configured as a ferrite tie bar.

Abstract: A magnetic effect sensor system has a target with a first set of regularly spaced tooth/slot transition target features and a second set of different tooth/slot transition target features interspersed within the regularly spaced features. The mix of target features allows a single magnetic effect sensor to output a clocking pulse train for misfire detection and an encoded pulse train for determining absolute mechanical position by utilizing two thresholds on the sensor output waveform.