Abstract: A shielded electronic circuit assembly is disclosed. An enclosure formed of a composite material comprising a structural material and a conductive material closes along a perimeter to surround an electronic circuit assembly. The conductive material can be embedded in or laminated or coated on the surface of the structural material to provide a composite material with sufficient conductivity to provide shielding from electromagnetic interference. The enclosure can further contain a conductive elastomeric bead, interlocked joint, or compression fit along the perimeter to assure that good conductive contact is achieved and maintained along the perimeter when the enclosure is closed. The enclosure is conductively coupled to ground.