Abstract: The invention relates to a seal for a sawing machine (1) for separating electronic components (12), comprising: an elongate form-retaining holder (20,22), a flexible, elongate expandable body (8,9)and a pressure source (24) for a medium, wherein the elongate expandable body (8,9) is provided with a strengthened elongate edge (21) which lies clear of the form-retaining holder (20,22) The invention also relates to a sawing machine (1) for separating electronic components (12) provided with such a seal.

Abstract: The invention relates to a seal for a sawing machine (1) for separating electronic components (12), comprising: an elongate form-retaining holder (20,22), a flexible, elongate expandable body (8,9)and a pressure source (24) for a medium, wherein the elongate expandable body (8,9) is provided with a strengthened elongate edge (21) which lies clear of the form-retaining holder (20,22) The invention also relates to a sawing machine (1) for separating electronic components (12) provided with such a seal.

Abstract: A device for encapsulating electronic components mounted on lead frames in a mold assembled from two mold halves movable relative to each other and closable onto each other. The device for causing the mold halves to move and to close are formed by a rotatable eccentric which can be coupled to one of the mold halves with interposing of at least one connecting rod. The invention also relates to a method for driving such a connecting rod. Another aspect of the invention relates to an encapsulating device wherein a one mold half is connectable to the device for causing the mold halves to move and close and the second mold half is connectable to a counter-plate which forms part of the device, which counter-plate is displaceable between two end positions. Yet another aspect of the invention relates to an encapsulating device with a counter-plate that includes a plurality of stacked, substantially plate-like parts, between which parts at least one shaft is placed.

Abstract: Apparatus for encapsulating products, for instance encapsulating lead frames with epoxy resin, wherein the apparatus comprises:one or more pressing devices for encapsulating the products at increased pressure and/or temperature;a first carriage device for transferring the products from supply means to the pressing device; anda second carriage device for discharging the encapsulated products from the pressing device to discharge means, wherein the first and second carriage are guidable along collective guide means.