Patents by Inventor Lan-Chin Chiou

Lan-Chin Chiou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220397946
    Abstract: An example ventilation system for a computing device includes: a cover slidably engageable with a housing of the computing device to a closed position defining an internal space of the computing device, the cover having first ventilation holes; a system mesh slidably engaged with the cover, the system mesh having second ventilation holes; and a stopper disposed in the internal space of the computing device, the stopper to stop the system mesh at a predefined position when the cover is engaged with the housing in the closed position, wherein the first ventilation holes and the second ventilation holes overlap to define system ventilation holes for the computing device.
    Type: Application
    Filed: October 31, 2019
    Publication date: December 15, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chin-Chang Ho, Hung-Ming Lin, Lan-Chin Chiou, Wei-Chih Tsao, Che-An Yao
  • Patent number: 11310936
    Abstract: Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: April 19, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shaheen Saroor, Lan-Chin Chiou, Hung-Ming Lin
  • Publication number: 20210153382
    Abstract: Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.
    Type: Application
    Filed: May 31, 2018
    Publication date: May 20, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Shaheen Saroor, Lan-Chin Chiou, Hung-Ming Lin