Abstract: An optical device for coupling light propagating between a waveguide and an optical transmission component is provided. The optical device includes a taper portion and a grating portion. The taper portion is disposed between the grating portion and the waveguide. The grating portion includes rows of grating patterns. A first size of a first grating pattern in a first row of grating patterns is larger than a second size of a second grating pattern in a second row of grating patterns. A first distance between the first row of grating patterns and the waveguide is less than a second distance between the second row of grating patterns and the waveguide.

Abstract: An optical communication system and a method of signal transmission are provided. The optical communication system includes an optical fiber, a transmission module, and a reception module. The transmission module includes a first optical circuitry operable to: receive a plurality of input optical signals and data; modulate the plurality of input optical signals in accordance with the data and a polarization state of the plurality of input optical signals to generate a plurality of modulated optical signals; combine the plurality of modulated optical signals to form a combined signal; and relaying the combined optical signal to the optical fiber. The optical fiber transmits the combined optical signal to the reception module for detection.

Abstract: A photoelectric device, an optical transceiver, and a method of operating the photoelectric device are provided. The photoelectric device include a first die and a second die. The first die has a first back side. The second die is disposed over the first die. The second die has a second back side bonded to the first back side. The second die includes an optical circuitry and an electrical circuitry. The optical circuitry is configured to generate or process a first optical signal. The electrical circuitry is electrically coupled to the first die, and is configured to control an operation of the optical circuitry by a first electrical signal inputted into the first die or to provide a second electrical signal to the first die in response to the first optical signal.

Abstract: A benchmark device and a method for evaluating a semiconductor wafer are provided. The benchmark device includes a first grating coupler, a second grating coupler and a waveguide. The waveguide has a least one bending section and is arranged in communication with the first grating coupler and the second grating coupler. The bending section comprises a first region having a first width and a first height, and a second region having a second width and a second height, wherein the first region is surrounded by the second region, and the second width decreases gradually from a first end of the bending section to a second end of the bending section.

Abstract: The present disclosure provides semiconductor devices and photonic circuits. The semiconductor device includes a substrate and an optical modulator disposed on the substrate. The optical modulator includes a first electrical coupling portion having a first type doping, a second electrical coupling portion having a second type doping, and an optical coupling portion disposed between the first electrical coupling portion and the second electrical coupling portion, where the optical coupling portion includes an intrinsic semiconductor. The optical modulator is configured to receive a first voltage through the first electrical coupling portion and the second electrical coupling portion to decrease a resonant wavelength of the optical modulator.

Abstract: An optical device for coupling light propagating between a waveguide and an optical transmission component is provided. The optical device includes a taper portion and a grating portion. The taper portion is disposed between the grating portion and the waveguide. The grating portion includes rows of grating patterns. A first size of a first grating pattern in a first row of grating patterns is larger than a second size of a second grating pattern in a second row of grating patterns. A first distance between the first row of grating patterns and the waveguide is less than a second distance between the second row of grating patterns and the waveguide.

Abstract: A method of characterizing a traveling-wave Mach-Zehnder modulator (TWMZM) includes measuring an electrooptic parameter, such as S21, of a test structure including a test TWMZM and a first instance of electrical pads which are connected to deliver a radio frequency (RF) signal to electrooptically modulate light traveling through the test TWMZM. The electrooptic parameter is similarly measured of a reference structure including a reference TWMZM and a second instance of the electrical pads which are connected to deliver the RF signal to electrooptically modulate light traveling through the reference TWMZM. A vestigial traveling-wave electrooptic phase modulator of the reference TWMZM is shorter than a traveling-wave electrooptic phase modulator of the test TWMZM. An electrooptic characteristic of the test TWMZM, such as S21 bandwidth, is determined by operations including subtracting the measured electrooptic S21 of the reference structure from the measured electrooptic S21 of the test structure.

Abstract: Disclosed is a system and method for communication using an efficient fiber-to-chip grating coupler with a high coupling efficiency.

Abstract: In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.

Abstract: A semiconductor structure according to the present disclosure includes a buried oxide layer, a first dielectric layer disposed over the buried oxide layer, a first waveguide feature disposed in the first dielectric layer, a second dielectric layer disposed over the first dielectric layer and the first waveguide feature, a third dielectric layer disposed over the second dielectric layer, and a second waveguide feature disposed in the second dielectric layer and the third dielectric layer. The second waveguide feature is disposed over the first waveguide feature and a portion of the second waveguide feature vertically overlaps a portion of the first waveguide feature.

Abstract: A benchmark device and a method for evaluating a semiconductor wafer are provided. The benchmark device includes a first grating coupler, a second grating coupler and a waveguide. The waveguide has a least one bending section and is arranged in communication with the first grating coupler and the second grating coupler. The bending section comprises a first region having a first width and a first height, and a second region having a second width and a second height, wherein the first region is surrounded by the second region, and the second width decreases gradually from a first end of the bending section to a second end of the bending section.

Abstract: Apparatus, circuits and methods for reducing mismatch in an electro-optic modulator are described herein. In some embodiments, a described optical includes: a splitter configured for splitting an input optical signal into a first optical signal and a second optical signal; a phase shifter coupled to the splitter; and a combiner coupled to the phase shifter. The phase shifter includes: a first waveguide arm configured for controlling a first phase of the first optical signal to generate a first phase-controlled optical signal, and a second waveguide arm configured for controlling a second phase of the second optical signal to generate a second phase-controlled optical signal. Each of the first and second waveguide arms includes: a plurality of straight segments and a plurality of curved segments. The combiner is configured for combining the first and second phase-controlled optical signals to generate an output optical signal.

Abstract: The present disclosure provides a photo sensing device and a method for forming a photo sensing device. The photo sensing device includes a substrate, a photosensitive member, a superlattice layer and a diffusion barrier structure. The substrate includes a silicon layer at a front surface. The photosensitive member extends into and at least partially surrounded by the silicon layer, wherein an upper portion of the photosensitive member protruding from the silicon layer has a top surface and a facet tapering toward the top surface. The superlattice layer is disposed between the photosensitive member and the silicon layer. The diffusion barrier structure is disposed at a first side of the photosensitive member and a bottom of the diffusion barrier structure is at a level below a top surface of the silicon layer, wherein at least a portion of the diffusion barrier structure is laterally surrounded by the silicon layer.

Abstract: Disclosed is a system and method for communication using an efficient fiber-to-chip grating coupler with a high coupling efficiency.

Abstract: An optical device includes a waveguide configured to guide light, a taper integrated with the waveguide on a substrate configured for optical coupling, and an attenuator to degrade unwanted optical signal from the taper. The attenuator extends along one side of the taper, and includes one of a conductive structure, a doped structure and a refractive structure.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The device includes a dielectric layer, a ring waveguide embedded in the dielectric layer, and an input/output (I/O) waveguide embedded in the dielectric layer and optically coupled to the ring waveguide in a vertical manner. Materials of the dielectric layer, the ring waveguide, and the I/O waveguide are different.

Abstract: The present disclosure provides a semiconductor device, a photonic circuit, and a method for adjusting a resonant wavelength of an optical modulator. The semiconductor device includes a substrate, a first waveguide disposed on the substrate, a second waveguide disposed on the substrate and spaced apart from the first waveguide by a first distance, and a heater disposed on the second waveguide and having a first terminal and a second terminal. In addition, the first terminal of the heater is configured to receive a first electrical signal; the second terminal of the heater is configured to receive a second electrical signal; and the heater is configured to carry a time-varying current in response to the first electrical signal and the second electrical signal.

Abstract: A semiconductor structure includes a plurality of semiconductor dies, a first stitch structure disposed in the plurality of semiconductor dies, and a second stitch structure disposed in at least two adjacent semiconductor dies of the plurality of semiconductor dies. The semiconductor dies are arranged to form a column or a row. The first stitch structure crosses all interfaces between the semiconductor dies. The second stitch structure crosses an interface between the at least two adjacent semiconductor dies.

Abstract: An exemplary package includes a photonic die, an electronic die, and a package component. The electronic die has an electronic device layer disposed between a frontside interconnect structure and a backside interconnect structure. The backside interconnect structure is configured to deliver power to the electronic device layer. The photonic die, the electronic die, and the package component are stacked top-to-bottom. The backside interconnect structure of the electronic die is connected to the package component, and the photonic die is connected to the electronic die. In some embodiments, the photonic die and the electronic die are each free of through semiconductor vias, such as through silicon vias. In some embodiments, a frontside interconnect structure of the photonic die is connected to the frontside interconnect structure of the electronic die. In some embodiments, a backside interconnect structure of the photonic die is connected to the frontside interconnect structure of the electronic die.

Abstract: Apparatus, circuits and methods for reducing mismatch in an electro-optic modulator are described herein. In some embodiments, a described optical includes: a splitter configured for splitting an input optical signal into a first optical signal and a second optical signal; a phase shifter coupled to the splitter; and a combiner coupled to the phase shifter. The phase shifter includes: a first waveguide arm configured for controlling a first phase of the first optical signal to generate a first phase-controlled optical signal, and a second waveguide arm configured for controlling a second phase of the second optical signal to generate a second phase-controlled optical signal. Each of the first and second waveguide arms includes: a plurality of straight segments and a plurality of curved segments. The combiner is configured for combining the first and second phase-controlled optical signals to generate an output optical signal.