Patents by Inventor Lan Hoang
Lan Hoang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230099638Abstract: Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.Type: ApplicationFiled: September 6, 2022Publication date: March 30, 2023Inventors: James C. CLEMENTS, Lan Hoang HOANG, Leilei ZHANG, Jacky G. KO, Jafir A. HAIDRI, Xinsheng CHU, Saahil MEHRA
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Publication number: 20220346228Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: ApplicationFiled: July 8, 2022Publication date: October 27, 2022Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Patent number: 11439573Abstract: A photopolymerizable composition suitable for forming a polymerized base coat of a substantially uniform mixture of nitrocellulose and crosslinked (meth)acrylate polymer is disclosed. The composition comprises an ethyl acetate solution including multiple (meth)acrylate monomers, nitrocellulose, a rapid release copolymer of alkyl acrylate monomers, a chain extended di-(hydroxyethylmethacryloyl) trimethylhexyl dicarbamate oligomer of weight average molecular weight of 10 to 20 kDa, one or more plasticizers and a photoinitiator.Type: GrantFiled: December 15, 2017Date of Patent: September 13, 2022Assignee: Wella Operations US LLCInventors: Xiaoyan Tu, Justina Vy Lan Hoang, Jay Jayasingha Kingsley
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Patent number: 11388817Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: GrantFiled: February 25, 2021Date of Patent: July 12, 2022Assignee: Apple Inc.Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Publication number: 20210185808Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: ApplicationFiled: February 25, 2021Publication date: June 17, 2021Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Publication number: 20210185831Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.Type: ApplicationFiled: January 28, 2021Publication date: June 17, 2021Inventors: Maryam Rahimi, Meng Chi Lee, Wyeman Chen, Leilei Zhang, Jason P. Marsh, Lan Hoang, Yashar Abdollahian
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Patent number: 10966321Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.Type: GrantFiled: June 5, 2020Date of Patent: March 30, 2021Assignee: Apple Inc.Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
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Patent number: 10959331Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: GrantFiled: June 26, 2020Date of Patent: March 23, 2021Assignee: Apple Inc.Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Publication number: 20210043597Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.Type: ApplicationFiled: March 30, 2020Publication date: February 11, 2021Inventors: Leilei Zhang, Jason P. Marsh, Lan Hoang, Yashar Abdollahian
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Publication number: 20200375033Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.Type: ApplicationFiled: June 5, 2020Publication date: November 26, 2020Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
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Publication number: 20200329559Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: ApplicationFiled: June 26, 2020Publication date: October 15, 2020Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Patent number: 10709018Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.Type: GrantFiled: May 30, 2019Date of Patent: July 7, 2020Assignee: Apple Inc.Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
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Patent number: 10701802Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: GrantFiled: November 15, 2019Date of Patent: June 30, 2020Assignee: Apple Inc.Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Patent number: 10624214Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.Type: GrantFiled: February 11, 2016Date of Patent: April 14, 2020Assignee: Apple Inc.Inventors: Amir Salehi, Takayoshi Katahira, Vu T. Vo, Wyeman Chen, Chang Liu, Dennis R. Pyper, Steven Patrick Cardinali, Lan Hoang, Siddharth Nangia, Meng Chi Lee
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Publication number: 20200084886Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: ApplicationFiled: November 15, 2019Publication date: March 12, 2020Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Patent number: 10485103Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.Type: GrantFiled: February 22, 2017Date of Patent: November 19, 2019Assignee: Apple Inc.Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
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Publication number: 20190336422Abstract: A photopolymerizable composition suitable for forming a polymerized base coat of a substantially uniform mixture of nitrocellulose and crosslinked (meth)acrylate polymer is disclosed. The composition comprises an ethyl acetate solution including multiple (meth)acrylate monomers, nitrocellulose, a rapid release copolymer of alkyl acrylate monomers, a chain extended di-(hydroxyethylmethacryloyl) trimethylhexyl dicarbamate oligomer of weight average molecular weight of 10 to 20 kDa, one or more plasticizers and a photoinitiator.Type: ApplicationFiled: December 15, 2017Publication date: November 7, 2019Inventors: Xiaoyan Tu, Justina Vy Lan Hoang, Jay Jayasingha Kingsley
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Publication number: 20190306979Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.Type: ApplicationFiled: May 30, 2019Publication date: October 3, 2019Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
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Patent number: 10356903Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.Type: GrantFiled: March 28, 2018Date of Patent: July 16, 2019Assignee: Apple Inc.Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
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Patent number: 9721921Abstract: A semiconductor device has a plurality of semiconductor die disposed over a carrier. An electrical interconnect, such as a stud bump, is formed over the semiconductor die. The stud bumps are trimmed to a uniform height. A substrate includes a bump over the substrate. The electrical interconnect of the semiconductor die is bonded to the bumps of the substrate while the semiconductor die is disposed over the carrier. An underfill material is deposited between the semiconductor die and substrate. Alternatively, an encapsulant is deposited over the semiconductor die and substrate using a chase mold. The bonding of stud bumps of the semiconductor die to bumps of the substrate is performed using gang reflow or thermocompression while the semiconductor die are in reconstituted wafer form and attached to the carrier to provide a high throughput of the flipchip type interconnect to the substrate.Type: GrantFiled: February 1, 2016Date of Patent: August 1, 2017Assignee: STATS ChipPAC Pte. Ltd.Inventors: KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan Hoang, Pandi C. Marimuthu, Steve Anderson, HunTeak Lee, HeeJo Chi