Abstract: This application provides a LED display by utilizing flexible wires and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on a transparent substrate, and this LED display is characterized in separating the wires crossing with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

Abstract: This application provides a LED display by utilizing flexible wires and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on a transparent substrate, and this LED display is characterized in separating the wires crossing with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

Abstract: This present invention provides a flexible LED display by utilizing flexible wirings and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on the transparent flexible substrate, and this flexible LED display which characterizes in separating the wirings crossing over with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

Abstract: This present invention provides a flexible LED display by utilizing flexible wirings and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on the transparent flexible substrate, and this flexible LED display which characterizes in separating the wirings crossing over with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

Abstract: An improved injection molded radiator assembly and antenna assembly can be made using multiple such radiator assemblies. The radiator assembly includes an injection molded radiator enclosure that forms an RF waveguide channel. A circuit/RF probe subassembly is mated to the radiator enclosure that houses a circulator assembly, input and output connectors, and an RF probe. An environmental plug is disposed in the radiator enclosure to seal the RF waveguide channel from the external environment.