Abstract: A robot arm assembly a base unit with a shoulder assembly rotatably disposed on the base unit. A lower robot arm is pivotably attached to the shoulder assembly. An upper robot arm is pivotably attached to the lower robot arm. The base unit includes a first motor which rotates a main shaft fixed to the shoulder assembly to rotate the shoulder. A second motor in the base unit rotates a second shaft in the shoulder assembly extending through the main shaft to pivot the lower robot arm with respect to the shoulder.

Abstract: A robot arm assembly a base unit with a shoulder assembly rotatably disposed on the base unit. A lower robot arm is pivotably attached to the shoulder assembly. An upper robot arm is pivotably attached to the lower robot arm. The base unit includes a first motor which rotates a main shaft fixed to the shoulder assembly to rotate the shoulder. A second motor in the base unit rotates a second shaft in the shoulder assembly extending through the main shaft to pivot the lower robot arm with respect to the shoulder.

Abstract: Solderable structures, and related methods for making them, can provide thermal conductivity and/or electrical isolation for electronic devices soldered to the structures. Each of the structures includes a solderable material bonded to a heat sink by a thermally-activated bonding material which provides thermal conductivity between the solderable material and the heat sink and which can be configured as a three-layer bonding film to also provide electrical isolation. The structures can be produced in a highly-automated, rapid way without the need for standard mounting hardware and mechanical preparation of the heat sinks.