Patents by Inventor Lance Barron
Lance Barron has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11746002Abstract: A method of forming a microelectromechanical device wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF conductor and a second RF conductors. The microelectromechanical device further comprises at least a center stack, a first RF stack, a second RF stack, a first stack formed on a first base layer, and a second stack formed on a second base layer, each stack disposed between the beam and the first and second RF conductors. The beam is configured to deflect downward to first contact the first stack formed on the first base layer and the second stack formed on the second base layer simultaneously or the center stack, before contacting the first RF stack and the second RF stack simultaneously.Type: GrantFiled: June 19, 2020Date of Patent: September 5, 2023Assignee: Qorvo US, Inc.Inventors: Robertus Petrus Van Kampen, Lance Barron, Richard L. Knipe
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Patent number: 11705298Abstract: A method of forming a microelectromechanical device is disclosed wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF conductor and a second RF conductor. The microelectromechanical device further comprises at least a center stack, a first RF stack, a second RF stack, a first stack formed on a first base layer, and a second stack formed on a second base layer, each stack disposed between the beam and the first and second RF conductors. The beam is configured to deflect downward to first contact the first stack formed on the first base layer and the second stack formed on the second base layer simultaneously or the center stack, before contacting the first RF stack and the second RF stack simultaneously.Type: GrantFiled: June 19, 2020Date of Patent: July 18, 2023Assignee: Qorvo US, Inc.Inventors: Robertus Petrus Van Kampen, Lance Barron, Richard L. Knipe
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Publication number: 20220289566Abstract: A method of manufacturing a MEMS device. The MEMS device has a cavity in which a beam will move to change the capacitance of the device. After most of the device build-up has occurred, sacrificial material is removed to free the beam within the MEMS device cavity. Thereafter, exposed ruthenium contacts are exposed to fluorine to either: dope exposed ruthenium and reduce surface adhesive forces, form fluorinated Self-Assembled Monolayers on the exposed ruthenium surfaces, deposit a nanometer passivating film on exposed ruthenium, or alter surface roughness of the ruthenium. Due to the fluorine treatment, low resistance, durable contacts are present, and the contacts are less susceptible to stiction events.Type: ApplicationFiled: August 6, 2020Publication date: September 15, 2022Inventors: James D. HUFFMAN, Mickael RENAULT, Shibajyoti GHOSH DASTIDER, Lance BARRON, Willibrordus G.M. VAN DEN HOEK
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Patent number: 11417487Abstract: The present disclosure generally relates to the design of a MEMS ohmic switch which provides for a low-impact landing of the MEMS device movable plate on the RF contact and a high restoring force for breaking the contacts to improve the lifetime of the switch. The switch has at least one contact electrode disposed off-center of the switch device and also has a secondary landing post disposed near the center of the switch device. The secondary landing post extends to a greater height above the substrate as compared to the RF contact of the contact electrode so that the movable plate contacts the secondary landing post first and then gently lands on the RF contact. Upon release, the movable plate will disengage from the RF contact prior to disengaging from the secondary landing post and have a longer lifetime due to the high restoring force.Type: GrantFiled: September 14, 2017Date of Patent: August 16, 2022Assignee: Qorvo US, Inc.Inventors: Richard L. Knipe, Robertus Petrus Van Kampen, James Douglas Huffman, Lance Barron
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Patent number: 11261084Abstract: A method of forming a microelectromechanical device wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF conductor and a second RF conductor. The microelectromechanical device further comprises at least a center stack, a first RF stack, a second RF stack, a first stack formed on a first base layer, and a second stack formed on a second base layer, each stack disposed between the beam and the first and second RF conductors. The beam is configured to deflect downward to first contact the first stack formed on the first base layer and the second stack formed on the second base layer simultaneously or the center stack, before contacting the first RF stack and the second RF stack simultaneously.Type: GrantFiled: June 19, 2020Date of Patent: March 1, 2022Assignee: QORVO US, INC.Inventors: Robertus Petrus Van Kampen, Lance Barron, Mickael Renault, Shibajyoti Ghosh Dastider, Jacques Marcel Muyango, Richard L. Knipe
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Patent number: 10964505Abstract: The present disclosure generally relates to a MEMS device for reducing ESD. A contacting switch is used to ensure that there is a closed electrical contact between two electrodes even if there is no applied bias voltage.Type: GrantFiled: November 15, 2016Date of Patent: March 30, 2021Assignee: Cavendish Kinetics, Inc.Inventors: Robertus Petrus Van Kampen, Lance Barron, Roberto Gaddi, Richard L. Knipe
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Publication number: 20200399115Abstract: A method of forming a microelectromechanical device wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF conductor and a second RF conductors. The microelectromechanical device further comprises at least a center stack, a first RF stack, a second RF stack, a first stack formed on a first base layer, and a second stack formed on a second base layer, each stack disposed between the beam and the first and second RF conductors. The beam is configured to deflect downward to first contact the first stack formed on the first base layer and the second stack formed on the second base layer simultaneously or the center stack, before contacting the first RF stack and the second RF stack simultaneously.Type: ApplicationFiled: June 19, 2020Publication date: December 24, 2020Inventors: Robertus Petrus Van Kampen, Lance Barron, Richard L. Knipe
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Publication number: 20200402755Abstract: A method of forming a microelectromechanical device is disclosed wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF conductor and a second RF conductor. The microelectromechanical device further comprises at least a center stack, a first RF stack, a second RF stack, a first stack formed on a first base layer, and a second stack formed on a second base layer, each stack disposed between the beam and the first and second RF conductors. The beam is configured to deflect downward to first contact the first stack formed on the first base layer and the second stack formed on the second base layer simultaneously or the center stack, before contacting the first RF stack and the second RF stack simultaneously.Type: ApplicationFiled: June 19, 2020Publication date: December 24, 2020Inventors: Robertus Petrus Van Kampen, Lance Barron, Richard L. Knipe
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Publication number: 20200399121Abstract: A method of forming a microelectromechanical device wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF conductor and a second RF conductor. The microelectromechanical device further comprises at least a center stack, a first RF stack, a second RF stack, a first stack formed on a first base layer, and a second stack formed on a second base layer, each stack disposed between the beam and the first and second RF conductors. The beam is configured to deflect downward to first contact the first stack formed on the first base layer and the second stack formed on the second base layer simultaneously or the center stack, before contacting the first RF stack and the second RF stack simultaneously.Type: ApplicationFiled: June 19, 2020Publication date: December 24, 2020Inventors: Robertus Petrus Van Kampen, Lance Barron, Mickael Renault, Shibajyoti Ghosh Dastider, Jacques Marcel Muyango, Richard L. Knipe
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Publication number: 20200185176Abstract: The present disclosure generally relates to the design of a MEMS ohmic switch which provides for a low-impact landing of the MEMS device movable plate on the RF contact and a high restoring force for breaking the contacts to improve the lifetime of the switch. The switch has at least one contact electrode disposed off-center of the switch device and also has a secondary landing post disposed near the center of the switch device. The secondary landing post extends to a greater height above the substrate as compared to the RF contact of the contact electrode so that the movable plate contacts the secondary landing post first and then gently lands on the RF contact. Upon release, the movable plate will disengage from the RF contact prior to disengaging from the secondary landing post and have a longer lifetime due to the high restoring force.Type: ApplicationFiled: September 14, 2017Publication date: June 11, 2020Inventors: Richard L. KNIPE, Jr., Robertus Petrus VAN KAMPEN, James Douglas HUFFMAN, Lance BARRON
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Publication number: 20190066958Abstract: The present disclosure generally relates to a MEMS device for reducing ESD. A contacting switch is used to ensure that there is a closed electrical contact between two electrodes even if there is no applied bias voltage.Type: ApplicationFiled: November 15, 2016Publication date: February 28, 2019Inventors: Robertus Petrus VAN KAMPEN, Lance BARRON, Roberto GADDI, Richard L. KNIPE
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Patent number: 9966194Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: GrantFiled: December 20, 2016Date of Patent: May 8, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal, Arthur M. Turner, John C. Ehmke
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Publication number: 20170098509Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: ApplicationFiled: December 20, 2016Publication date: April 6, 2017Inventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal, Arthur M. Turner, John C. Ehmke
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Patent number: 9573801Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: GrantFiled: February 15, 2016Date of Patent: February 21, 2017Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal
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Publication number: 20170026730Abstract: A microphone includes a base, a MEMS device, and an integrated circuit. The MEMS device includes a diaphragm and a back plate. The MEMS device is connected to the integrated circuit. The microphone also includes a temperature sensor. A lid enclosed the MEMS device and the integrated circuit.Type: ApplicationFiled: July 21, 2016Publication date: January 26, 2017Applicant: Knowles Electronics, LLCInventors: John J. Albers, Joshua Watson, Lance Barron, Kurt B. Friel, Norman Dennis Talag
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Publication number: 20160176701Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: ApplicationFiled: February 15, 2016Publication date: June 23, 2016Inventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal, Arthur M. Turner, John C. Ehmke, James C. Baker
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Publication number: 20160037263Abstract: A micro electro mechanical system (MEMS) microphone includes a base; a MEMS die disposed on the base; and a cover coupled to the base and enclosing the MEMS die. The MEMS die includes and diaphragm and back plate and posts extend from a first periphery of the back plate. The diaphragm is free to move within a boundary created by the posts. A front volume is formed on a first side of the diaphragm and a back volume is formed on a second side of the diaphragm between the diaphragm and the cover. A plurality of openings extend through the diaphragm about an outer periphery of the diaphragm, the openings being effective to mitigate noise.Type: ApplicationFiled: July 24, 2015Publication date: February 4, 2016Inventors: Sagnik Pal, Lance Barron, Sung Lee