Abstract: A method of forming an electronic assembly includes attaching a backside metal layer the bottomside of a semiconductor die. An area of the backside metal layer matches an area of the bottomside of the die. A die pad and leads are encapsulated within the molding material. The leads include an exposed portion that includes a bonding portion. A gap exposes the backside metal layer along a bottom surface of the package. Bond wires couple the pads on the topside of the die to the leads and the bonding portions. Packaged semiconductor device is soldered to a printed circuit board (PCB). The backside metal layer and the bonding portions of the leads are soldered substrate pads on said PCB.

Abstract: A method for packing a semiconductor device 301 in a carrier tape 406 without damage to the leads 302 includes an interlocking mechanism between the molded semiconductor device with indentations 305 formed into the package body, and the carrier tape having mating protrusions 407 slightly smaller than the indentations which cause the device to be held securely without significant movement after a cover tape 409 is adhered to the carrier tape. The features of correctly sized pockets and pedestals, the cover tape, and the interlocking device indentations and tape protrusions prevent damage to the device leads as a result of impact.

Abstract: An illumination system for wire bonding at wire bonding locations which includes a first light source for directing light to the location to be illuminated along a predetermined axis, preferably normal to the wire bonding location, and a second light source having an aperture therethrough extending along the predetermined axis directing light in a pattern from around the aperture to the location to be illuminated. A portion of the light is reflectable back from the location to be illuminated through the aperture. The first light source directs light therefrom through the aperture. The light from the second light source for viewing of the lead frame comes from around the object and is diffused so that it scatters in all directions and at all angles. The amount of scattering depends upon the surface roughness at the edge of the light conductor from which the light exits the light conductor.

Abstract: An illumination system for wire bonding at wire bonding locations which includes an illuminator having a highly light transmissive portion with an end surface and an axial bore extending therethrough and terminating at the end surface. The illuminator includes a first light source for directing light substantially axially through the bore to the end surface and a second light source for directing light substantially axially through the highly light transmissive portion to the end surface. The end surface is preferably a light diffusing surface. The bore is preferably tapered with the taper widening in a direction toward the end surface. The surface of the bore is preferably a light diffusing surface. The bore can alternately include a layer of highly light reflecting material disposed on its surface. The highly light transmissive portion has an outer surface which can include a layer of highly light reflecting material disposed thereon.