Patents by Inventor Lance Cheney
Lance Cheney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240013338Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: September 20, 2023Publication date: January 11, 2024Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20240005443Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: August 24, 2023Publication date: January 4, 2024Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 11763416Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: October 13, 2021Date of Patent: September 19, 2023Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 11756150Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: February 17, 2022Date of Patent: September 12, 2023Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 11410266Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: October 13, 2020Date of Patent: August 9, 2022Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 11386521Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: GrantFiled: January 29, 2021Date of Patent: July 12, 2022Assignee: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20220188967Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets, With such an interchangeable design, cache or DRAM memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: ApplicationFiled: March 2, 2022Publication date: June 16, 2022Applicant: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20220180468Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: February 17, 2022Publication date: June 9, 2022Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20220036500Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: October 13, 2021Publication date: February 3, 2022Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20210256654Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: ApplicationFiled: January 29, 2021Publication date: August 19, 2021Applicant: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20210133913Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: October 13, 2020Publication date: May 6, 2021Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 10909652Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: GrantFiled: March 15, 2019Date of Patent: February 2, 2021Assignee: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 10803548Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: March 15, 2019Date of Patent: October 13, 2020Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20200294181Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: March 15, 2019Publication date: September 17, 2020Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20200294180Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: ApplicationFiled: March 15, 2019Publication date: September 17, 2020Applicant: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 7904701Abstract: Provided are a method and system for activating a design test mode in a graphics card having multiple execution units. A design test mode is activated in a graphics module comprising multiple execution units coupled to a cache on a bus. The bus is configured to return test instructions from the cache to the execution units in response to a request from one execution unit for the test instructions from the cache in the design test mode. The execution units execute the test instructions during the design test mode. Interrupts are prevented during the design test mode.Type: GrantFiled: June 7, 2007Date of Patent: March 8, 2011Assignee: Intel CorporationInventors: Anthony Babella, Allan Wong, Lance Cheney, Brian D. Rauchfuss
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Patent number: 7793187Abstract: Provided are a method and system checking output from multiple execution units. Execution units concurrently execute test instructions to generate test output, wherein test instructions are transferred to the execution units from a cache coupled to the execution units over a bus. The test output from the execution units is compared to determine whether the output from the execution units indicates the execution units are properly concurrently executing test instructions. The result of the comparing of the test output are forwarded to a design test unit.Type: GrantFiled: June 7, 2007Date of Patent: September 7, 2010Assignee: Intel CorporationInventors: Allan Wong, Lance Cheney
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Publication number: 20080307261Abstract: Provided are a method and system for activating a design test mode in a graphics card having multiple execution units. A design test mode is activated in a graphics module comprising multiple execution units coupled to a cache on a bus. The bus is configured to return test instructions from the cache to the execution units in response to a request from one execution unit for the test instructions from the cache in the design test mode. The execution units execute the test instructions during the design test mode. Interrupts are prevented during the design test mode.Type: ApplicationFiled: June 7, 2007Publication date: December 11, 2008Inventors: Anthony BABELLA, Allan WONG, Lance CHENEY, Brian D. RAUCHFUSS
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Publication number: 20080307275Abstract: Provided are a method and system checking output from multiple execution units. Execution units concurrently execute test instructions to generate test output, wherein test instructions are transferred to the execution units from a cache coupled to the execution units over a bus. The test output from the execution units is compared to determine whether the output from the execution units indicates the execution units are properly concurrently executing test instructions. The result of the comparing of the test output are forwarded to a design test unit.Type: ApplicationFiled: June 7, 2007Publication date: December 11, 2008Inventors: Allan WONG, Lance CHENEY
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Patent number: D592319Type: GrantFiled: May 21, 2007Date of Patent: May 12, 2009Inventor: Lance Cheney