Patents by Inventor Lance Cole Wright
Lance Cole Wright has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11908780Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.Type: GrantFiled: November 3, 2021Date of Patent: February 20, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez
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Patent number: 11658130Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.Type: GrantFiled: December 31, 2020Date of Patent: May 23, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Tianyi Luo, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez, Lance Cole Wright
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Publication number: 20220208692Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Applicant: Texas Instruments IncorporatedInventors: Tianyi Luo, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez, Lance Cole Wright
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Publication number: 20220115308Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.Type: ApplicationFiled: November 3, 2021Publication date: April 14, 2022Inventors: Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez
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Patent number: 11177197Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.Type: GrantFiled: September 25, 2019Date of Patent: November 16, 2021Assignee: Texas Instruments IncorporatedInventors: Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez
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Publication number: 20210090980Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.Type: ApplicationFiled: September 25, 2019Publication date: March 25, 2021Inventors: Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez
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Patent number: 9899339Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.Type: GrantFiled: November 5, 2012Date of Patent: February 20, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Patent number: 9111845Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: GrantFiled: August 26, 2014Date of Patent: August 18, 2015Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Patent number: 8945986Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.Type: GrantFiled: January 14, 2014Date of Patent: February 3, 2015Assignee: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140361402Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: ApplicationFiled: August 26, 2014Publication date: December 11, 2014Inventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Patent number: 8847349Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: GrantFiled: December 21, 2012Date of Patent: September 30, 2014Assignee: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Screenivasan K. Koduri
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Patent number: 8816513Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.Type: GrantFiled: August 22, 2012Date of Patent: August 26, 2014Assignee: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140175599Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140124939Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.Type: ApplicationFiled: November 5, 2012Publication date: May 8, 2014Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140127856Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.Type: ApplicationFiled: January 14, 2014Publication date: May 8, 2014Applicant: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140054795Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.Type: ApplicationFiled: August 22, 2012Publication date: February 27, 2014Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20080290481Abstract: The invention provides semiconductor device packages, leadframes, and methods for their manufacture, with improved characteristics for the formation of metallurgical joints. In a disclosed preferred embodiment of a semiconductor device leadframe according to the invention, a generally rectangular sheet metal body has a semiconductor device mounting site for receiving a semiconductor device. Leadfingers extend from the proximity of the device mounting site the outer edges of the leadframe. An anchor pad is included at each corner of the leadframe body, each anchor pad having a patterned surface. According disclosed aspects of the invention, the patterned surfaces of the anchor pads may include indented, embossed, or cut-out portions. According to other aspects of the invention, patterned anchor pad surfaces are plated with a low-melting point alloy and remain exposed at the corners of an encapsulated package.Type: ApplicationFiled: May 25, 2007Publication date: November 27, 2008Inventors: Takahiko Kudoh, Lance Cole Wright
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Patent number: 7320903Abstract: A carrier and package for plural semiconductor devices includes a member with device-conformal apertures therethrough. A first removable cover is attached to one side of the member to close one end of each aperture. After devices are inserted into the apertures with their first ends “up” and their second ends “down,” a second removable cover is attached to the other side of the member to close the other end of each aperture. After inverting the assembly, removal of the first cover presents the devices in the apertures with their second ends “up” and their first ends “down.Type: GrantFiled: November 1, 2005Date of Patent: January 22, 2008Assignee: Texas Instruments IncorporatedInventor: Lance Cole Wright
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Patent number: 6977191Abstract: A carrier and package for plural semiconductor devices includes a member with device-conformal apertures therethrough. A first removable cover is attached to one side of the member to close one end of each aperture. After devices are inserted into the apertures with their first ends “up” and their second ends “down,” a second removable cover is attached to the other side of the member to close the other end of each aperture. After inverting the assembly, removal of the first cover presents the devices in the apertures with their second ends “up” and their first ends “down.Type: GrantFiled: March 1, 2004Date of Patent: December 20, 2005Assignee: Texas Instruments IncorporatedInventor: Lance Cole Wright
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Publication number: 20040226857Abstract: A reel adapted to have chip carrier tape wound thereabout includes at least one flange and a plastic rail. The flange is made from a paper-based material. The plastic rail is attached an interior major surface of the paper flange. The plastic rail may extend along a radial direction of the flange and/or along a circumferential direction of the flange, for example. The plastic rail may be substantially straight and/or curved, for example. The plastic rail is preferably made from a static dissipative material. The plastic rail reduces or eliminates the generation of paper particles from the paper-based flange while reeling/unreeling chip carrier tape from the reel.Type: ApplicationFiled: May 15, 2003Publication date: November 18, 2004Inventors: Lance Cole Wright, Albert Dulay Escusa