Abstract: In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

Abstract: In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

Abstract: In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

Abstract: In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

Abstract: A powder handling system that includes a first powder deposition device for depositing a primary powder on a surface at a predetermined speed; and a second powder deposition device for depositing a secondary powder onto the primary powder in at least two directions relative to the surface, wherein the second powder deposition device includes a reservoir for containing the secondary powder; and a rotating shaft connected to the reservoir, wherein the rotating shaft includes a speed of rotation, an angle of rotation, a number of rotations, and a notch geometry, and wherein the rotating shaft is adapted to deposit the secondary powder onto the primary powder at a predetermined rate of deposition, and wherein the predetermined rate of deposition is controlled by adjusting the speed of rotation of the shaft, adjusting the angle of rotation of the shaft, adjusting the number of rotations of the shaft, adjusting the notch geometry of the shaft, or a combination thereof.