Abstract: A drive system for each arm of a mobile robot, each drive system including a drive motor and an adjustable clutch system interconnected between its associated arm and the drive motor and having a high friction locked position for enabling direct drive of the arm by the drive motor and a reduced friction slip position for enabling manual movement of the associated arm without back-driving the drive motor.

Abstract: A modular mobile robot with a chassis including a power source housed therein. Right and left hand track modules are each removeably coupled to the robot chassis. Each track module includes a side plate, at least one drive wheel rotatable with respect to the side plate, a motor for driving the drive wheel, at least one idler rotatable with respect to the side plate, and a track extending around the drive wheel, the side plate, and the idler. A turret assembly with its own turret drive subsystem is removeably coupled to the robot chassis via a quick release mechanism.

Abstract: A modular mobile robot with a chassis including a power source housed therein. Right and left hand track modules are each removeably coupled to the robot chassis. Each track module includes a side plate, at least one drive wheel rotatable with respect to the side plate, a motor for driving the drive wheel, at least one idler rotatable with respect to the side plate, and a track extending around the drive wheel, the side plate, and the idler. A turret assembly with its own turret drive subsystem is removeably coupled to the robot chassis via a quick release mechanism.

Abstract: A modular mobile robot with a chassis including a power source housed therein. Right and left hand track modules are each removeably coupled to the robot chassis. Each track module includes a side plate, at least one drive wheel rotatable with respect to the side plate, a motor for driving the drive wheel, at least one idler rotatable with respect to the side plate, and a track extending around the drive wheel, the side plate, and the idler. A turret assembly with its own turret drive subsystem is removeably coupled to the robot chassis via a quick release mechanism.

Abstract: A drive system for each arm of a mobile robot, each drive system including a drive motor and an adjustable clutch system interconnected between its associated arm and the drive motor and having a high friction locked position for enabling direct drive of the arm by the drive motor and a reduced friction slip position for enabling manual movement of the associated arm without back-driving the drive motor.

Abstract: A modular mobile robot with a chassis including a power source housed therein. Right and left hand track modules are each removeably coupled to the robot chassis. Each track module includes a side plate, at least one drive wheel rotatable with respect to the side plate, a motor for driving the drive wheel, at least one idler rotatable with respect to the side plate, and a track extending around the drive wheel, the side plate, and the idler. A turret assembly with its own turret drive subsystem is removeably coupled to the robot chassis via a quick release mechanism.

Abstract: A shield is applied to a permeable core in a predetermined pattern, where the predetermined pattern covers less than the entire surface area of the permeable core.

Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.

Abstract: A shield is applied to a permeable core in a predetermined pattern, where the predetermined pattern covers less than the entire surface area of the permeable core.

Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.

Abstract: A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator is set forth. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A further structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor is presented.

Abstract: A heat generating component is encapsulated within an encapsulant. A window is made in the encapsulant to expose a heat dissipating surface of the component and a heat sinking device is attached to the heat dissipating surface of the heat generating component. The window is formed using a laser.

Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.

Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.