Patents by Inventor Lance L. Chandler

Lance L. Chandler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7550806
    Abstract: A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: June 23, 2009
    Assignee: Intersil Americas Inc.
    Inventors: Daniel J. DeBeer, Lance L. Chandler
  • Patent number: 7332814
    Abstract: A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: February 19, 2008
    Assignee: Intersil Americas Inc.
    Inventors: Daniel J. DeBeer, Lance L. Chandler