Patents by Inventor Lance Liu

Lance Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968296
    Abstract: Disclosed are methods for encrypting communications with a remote endpoint via a memory device. In one embodiment, a memory device is configured to receive, from the application, a request to establish a communications session with a remote computing device, establish a shared symmetric key, the shared symmetric key shared between the memory device and the remote computing device, receive a message from the application, the message including an identifier of the remote computing device and a payload, generate a ciphertext using the symmetric key and the payload, and return the ciphertext to the application.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: April 23, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Zhan Liu, Lance W. Dover
  • Patent number: 11930620
    Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: March 12, 2024
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
  • Publication number: 20230377972
    Abstract: A die separation ring that causes non-uniform expansion of a semiconductor wafer during a semiconductor wafer expansion process. The die separation ring includes an annular body that extends about a central axis. The annular body of the die separation ring includes a first portion having a first elevation and a second portion having a second elevation that is lower than the first elevation. A third portion extends between the first portion and the second portion forming a transition between the first portion and the second portion.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Shuo Li, Jacky Liu, Lance Liu, Legend Xin, Weiting Jiang, Zhenghao Wu, Bo Yang
  • Patent number: 5906182
    Abstract: The present invention relates to a piston for an internal combustion engine. The piston includes a crown defined by a combustion surface and a cylindrical ring belt. The cylindrical ring belt has a first and a second ring groove extending about the circumference thereof, where the ring grooves are adapted to receive a first and a second piston ring. The combustion surface and the first ring groove define a first ring land therebetween. The first ring groove and the second ring groove define a second ring land therebetween. The cylindrical ring belt also has an elastic groove extending about the circumference thereof. The elastic groove has an upper wall and a lower wall interconnected by a radius "R", where the upper wall and the lower wall pivot about the radius "R", under loading of the piston to lower stress concentration within the crown.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: May 25, 1999
    Assignee: General Motors Corporation
    Inventors: James Leonard Blase, Richard Wayne Tupek, Chih Lance Liu