Abstract: Methods of forming a near field transducer (NFT), the methods including the steps of depositing plasmonic material on a substrate; laser annealing at least a portion of the deposited plasmonic material at a wavelength from 100 nm to 2.0 micrometers (?m) to induce liquid phase epitaxy (LPE) in the annealed deposited plasmonic material to form a epitaxially modified plasmonic material; and forming a NFT from at least a portion of the epitaxially modified plasmonic material are disclosed as well as other methods and devices such as those formed.

Abstract: A cleaning device for a medical instrument including a flushing chamber, the flushing chamber having a lumen sized and configured to accept a distal end portion of the medical instrument during a cleaning process. The flushing chamber has an inlet port and an outlet port. Proximal and distal sealing members of the flushing chamber seal about the medical instrument when the instrument is inserted into the lumen of the flushing chamber.

Abstract: A cleaning device for a medical instrument including a flushing chamber, the flushing chamber having a lumen sized and configured to accept a distal end portion of the medical instrument during a cleaning process. The flushing chamber has an inlet port and an outlet port. Proximal and distal sealing members of the flushing chamber seal about the medical instrument when the instrument is inserted into the lumen of the flushing chamber.

Abstract: A cleaning device for a medical instrument including a flushing chamber, the flushing chamber having a lumen sized and configured to accept a distal end portion of the medical instrument during a cleaning process. The flushing chamber has an inlet port and an outlet port. Proximal and distal sealing members of the flushing chamber seal about the medical instrument when the instrument is inserted into the lumen of the flushing chamber.

Abstract: A cleaning device for a medical instrument including a flushing chamber, the flushing chamber having a lumen sized and configured to accept a distal end portion of the medical instrument during a cleaning process. The flushing chamber has an inlet port and an outlet port. Proximal and distal sealing members of the flushing chamber seal about the medical instrument when the instrument is inserted into the lumen of the flushing chamber.

Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.

Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.

Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.

Abstract: A method includes processing a workpiece in accordance with a first operating recipe. The workpiece is processed in accordance with a second operating recipe subsequent to processing the workpiece in accordance with the first operating recipe. A characteristic of the workpiece is measured after processing in accordance with the second operating recipe. An operating recipe parameter is determined for the first operating recipe based on the measured characteristic. A processing line includes first and second process tools, a metrology tool, and a controller. The first process tool is configured to process a workpiece in accordance with a first operating recipe. The second process tool is configured to process the workpiece in accordance with a second operating recipe subsequent to the processing of the workpiece in accordance with the first operating recipe by the first process tool. The metrology tool is configured to measure a characteristic of the workpiece after processing in the second process tool.