Abstract: An apparatus and method are provided for testing a semiconductor device (DUT). Generally, the apparatus includes an interface board with conductive elements adapted to electrically couple with the DUT and connected to a number of test circuits. Each test circuit resides on one of a number of daughter cards on the interface board, and provides test input signals to and receives output signals from the DUT to generate a result based on a program loaded to the daughter cards before testing begins. The apparatus further includes a controller to drive the interface board and store test results. In one embodiment, the interface board is a load board for back end testing. In another embodiment, the interface board is a probe card for front end testing. Preferably, the apparatus is capable of testing DUTs including memory arrays, logic circuits or both, and the daughter cards are capable of being re-programmed and re-used on different DUTs.

Abstract: A method for integrated device testing can include the steps of: receiving wafer test data that identifies wafer test failures with the dice tested while part of a shared common substrate; receiving package test data that identifies test failures for at least a subset of the dice after the dice have been separated and assembled into different packages; identifying non-unique coverage test sets that include at least one wafer test or package test that generates failures that correlates with failures generated by another wafer test or package test for the same dice; and identifying unique coverage tests that include failures generated by wafer tests or package tests that do not correlate with failures generated by any other another wafer test or package test for the same dice.