Patents by Inventor Lance Swan

Lance Swan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections
    Patent number: 8790742
    Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: July 29, 2014
    Assignee: Nscrypt, Inc.
    Inventors: Kenneth H. Church, Patrick Clark, Dongjiang Xu, Lance Swan, Bryan Irwin, Vladimir Pelekhaty
  • METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC CHIPS BY MICRODISPENSED INTERCONNECTIONS
    Publication number: 20110237002
    Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.
    Type: Application
    Filed: June 10, 2011
    Publication date: September 29, 2011
    Applicant: NSCRYPT, INC.
    Inventors: KENNETH H. CHURCH, PATRICK CLARK, DONGJIANG XU, LANCE SWAN, BRYAN IRWIN, VLADIMIR PELEKHATY
  • Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections
    Patent number: 7972650
    Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: July 5, 2011
    Assignee: nScrypt, Inc.
    Inventors: Kenneth H. Church, Patrick Clark, Dongjiang Xu, Lance Swan, Bryan Irwin, Vladimir Pelekhaty